ʻO ka hana ʻana o ka PCBA ma o ka helu ʻo ia ka huahana mai ke kaʻina hana a hiki i ke kaʻina aʻe ma waena o ka manawa e pono ai e ʻai, a laila ʻoi aku ka liʻiliʻi o ka manawa, ʻoi aku ka kiʻekiʻe o ka pono, ʻoi aku ka kiʻekiʻe o ka hopena, ma hope o nā mea a pau, aia wale nō ke pilikia ʻole kāu huahana. e kahe aku i kahi hou.Me kēia pilikia ke kamaʻilio nei mākou e pili ana i ka hoʻokumu ʻana o nā hui solder ma PCBA welding pulling tip a me ka hopena:
1. PCB kaapuni papa i loko o ka preheating pae wela haʻahaʻa loa, preheating manawa ua pōkole loa, no laila, i ka PCB a me ka mea wela mea haʻahaʻa, kuʻihao mea a me ka PCB wela absorption i hana convex punch.
2. He haʻahaʻa loa ka wela o ka hoʻokomo ʻana o SMT a i ʻole ka wikiwiki o ke kāʻei conveyor, no laila ʻoi aku ka nui o ka viscosity o ka solder hehee.
3. He kiʻekiʻe ke kiʻekiʻe o ke kiʻekiʻe o ka nalu electromagnetic pump wave soldering machine a i ʻole ka lōʻihi o ka pine, no laila ʻaʻole hiki i ka lalo o ka pine ke hoʻopili me ka piko nalu.No ka mea, ʻo ka mīkini hollow wave electromagnetic pump wave soldering machine is hollow wave, the thickness of the hollow wave is 4 ~ 5mm.
4. ʻAʻole maikaʻi ka hana flux.
5. ʻAʻole pololei nā ʻāpana pahu pahu DIP i ke anawaena a me ka ratio o ka pahu pahu pahu, ʻoi aku ka nui o ka puka pahu pahu, ʻoi aku ka wela o ka pad.
ʻO nā wahi pilikia ma luna nei nā kumu nui loa i ka hanauna o ka solder joint pulling tip, no laila pono mākou e hana i ka optimization kūpono a me ka hoʻoponopono ʻana no nā pilikia i luna ma ke kaʻina hana smt, e hoʻoponopono i ka pilikia ma mua o ka hiki ʻana, e hōʻoia i ka hua a ka wikiwiki o ka lawe ʻana.
1. Tin hawewe wela o 250 ℃ ± 5 ℃, welding manawa 3 ~ 5s;He haʻahaʻa iki ka mahana, ʻo ka wikiwiki o ke kāʻei conveyor e lohi i kekahi.
2. Hoʻomalu ʻia ke kiʻekiʻe o ka nalu ma ka 2/3 o ka mānoanoa o ka papa i paʻi ʻia.ʻO ka hoʻokomo ʻia ʻana o ka pine ʻāpana e pono ai e hōʻike ʻia nā pine ʻāpana i ka mea i paʻi ʻia
3. Papa soldering ili 0.8mm~3mm.
4. Hoʻololi i ka flux.
5. He 0.15 ~ 0.4mm ka nui o ka puka o ka pahu pahu pahu ma mua o ke anawaena o ke alakai (e lawe ke alakai maikai i ka laina lalo, e lawe ke alakai manoanoa i ka palena o luna).
Nā hiʻohiʻona o NeoDen IN6 Reflow Oven
1. Full convection, maikaʻi loa soldering hana.
2. Hoʻolālā 6 zones, māmā a paʻa.
3. ʻO ka mana akamai me ke kiʻekiʻe sensitivity wela sensor, hiki ke hoʻopaʻa ʻia ka mahana i loko o + 0.2 ℃.
4. ʻO ka ʻōnaehana kānana uwahi i kūkulu ʻia, ka hiʻohiʻona nani a me ka ʻoluʻolu.
5. Heat insulation hoʻolālā palekana, hiki ke hoʻomalu i ka mahana casing i loko o 40 ℃.
6. ʻO ka lako mana o ka hale, kūpono a kūpono.
Ka manawa hoʻouna: Iune-20-2023