He aha nā hiʻohiʻona o ka reflow welding kaʻina?

ʻO ka hoʻoheheʻe kahe ʻana e pili ana i kahi kaʻina hana hoʻoheheʻe e ʻike ai i nā pilina mechanical a me ka uila ma waena o nā hopena solder a i ʻole nā ​​pine o nā ʻāpana hui ili a me nā pad solder PCB ma o ka hoʻoheheʻe ʻana i ka solder paste i paʻi mua ʻia ma nā pad solder PCB.
1. Kaʻina hana
Kaʻina hana o ka reflow soldering: paʻi solder paste → monter → reflow soldering.

2. Kaʻina hana
Hiki ke mālama ʻia ka nui o ka hui solder.Hiki ke loaʻa ka nui a i ʻole ke ʻano o ka hui solder mai ka hoʻolālā nui o ka pad a me ka nui o ka paʻi i paʻi ʻia.
Hoʻohana pinepine ʻia ka paʻi welding e ka paʻi pale kila.I mea e maʻalahi ai ka holo ʻana o ke kaʻina hana a hoʻemi i ke kumukūʻai hana, ʻo ka mea maʻamau hoʻokahi wale nō paʻi kuʻi ʻia i paʻi ʻia no kēlā me kēia wili.Pono kēia hiʻohiʻona e hiki i nā ʻāpana o kēlā me kēia alo hui ke puʻunaue i ka paʻi solder me ka hoʻohana ʻana i hoʻokahi mesh (me ka mesh o ka mānoanoa like a me ka mesh stepped).

ʻO ke kapuahi reflow he umu ahi tunnel multi-mahana nona ka hana nui i ka wela PCBA.Pono nā ʻāpana i hoʻonohonoho ʻia ma ka ʻaoʻao lalo (ʻaoʻao B) e hoʻokō i nā koi mechanical paʻa, e like me ka pūʻolo BGA, ka nui o nā ʻāpana a me ka lākiō ʻāpana pili pin ≤0.05mg/mm2, i mea e pale ai i ka hāʻule ʻana o nā mea ʻili o luna i ka wā wili.

I ka hoʻoheheʻe hou ʻana, lana loa ka ʻāpana ma luna o ka solder hehee (solder joint).Inā ʻoi aku ka nui o ka pad ma mua o ka nui o ka pine, ʻoi aku ke kaumaha o ka hoʻonohonoho ʻāpana, a ʻoi aku ka liʻiliʻi o ka hoʻonohonoho pine, hiki ke hoʻoneʻe ʻia ma muli o ka asymmetric molten solder surface asymmetric a i ʻole convective convective convective heat e puhi ana i loko o ka umu reflow.

ʻO ka ʻōlelo maʻamau, no nā ʻāpana hiki ke hoʻoponopono i ko lākou kūlana ma o lākou iho, ʻoi aku ka nui o ka ratio o ka nui o ka pad i ka ʻāpana overlap o ka hopena welding a i ʻole pin, ʻoi aku ka ikaika o ka hana hoʻonohonoho o nā mea.ʻO kēia kahi a mākou e hoʻohana ai no ka hoʻolālā kikoʻī o nā pads me nā koi kūlana.

ʻO ka hoʻokumu ʻana o ka weld (spot) morphology e hilinaʻi nui ʻia i ka hana o ka hiki ke hoʻomaʻemaʻe a me ka ʻili o ka ʻili o ka solder hehee, e like me 0.44mmqfp.He cuboid maʻamau ke ʻano hoʻohālike solder paste i paʻi ʻia.