He aha nā mea maikaʻi o ka BGA rework station?

He aha nā pōmaikaʻi o kaBGA hana hou?E nānā kākou.

1. Mana ikaika a me ka pono koho hana, hoʻomanaʻo i ewalu ano o ka wela curves, mea hoʻohana hiki ke koho i kekahi hoʻomehana pā e like me nā koi o ka desoldering.

2. ʻO ka hoʻomehana ʻana o ka curve akamai, hiki iā ʻoe ke hoʻopau i ke kaʻina desoldering holoʻokoʻa e like me kāu curve wela preset, e hana ana i ke kaʻina desoldering holoʻokoʻa i ʻike ʻepekema.

3. ʻEkolu-dimensional hoʻololi o ke kukui kino, retractable slide frame nenoaiu, kūpono no kekahi huina huina desoldering, infrared kino kukui me ka laser positioning, no laila, i ka hoʻololi 'ana i oi maʻalahi hoʻonohonoho pono.

4. ʻO ka ʻenehana hoʻomalu wela naʻauao PID, ʻoi aku ka pololei o ka mālama ʻana i ka mahana, ʻoi aku ka maikaʻi o ka pihi, hiki ke pale maikaʻi i ka piʻi wikiwiki ʻana a i ʻole ka piʻi ʻana o ka mahana a hoʻopōʻino i ka chip a i ʻole ka papa kaapuni.

5.Ultra-kiʻekiʻe mana preheating hooheheeia kelu nenoaiu, a me ka hoʻohana 'ana i ka hoʻomōhala pono'ī infrared mehana, ikaika komo, mea hoʻomehana wela uniformity, oi pololei wela mana.Hiki iā ʻoe ke hoʻopau a hana hou i ka BGA, SMD, CSP, LGA, QFP, PLCC a me BGA implant pōpō, nā lālani like ʻole o nā ʻāpana plug a me nā kumu pine (e like me ke kumu CPU a me ka lālani plug GAP), hiki ke hoʻokō piha i ke kamepiula, notebook, e- nā pāʻani a me nā koi ʻē aʻe BGA desoldering / hana hou, kūpono loa no ka lolouila ʻākau a me ka hema alahaka desoldering.

6.Friendly man-machine interface, hōʻike LCD maikaʻi loa, ke kaʻina hana hoʻomehana holoʻokoʻa no ʻoe e hoʻomaopopo i ka nānā.

7.Rigid hiʻohiʻona, ka leo māmā, mai ka hoʻomaka a hiki i ka hoʻopau ʻana e noʻonoʻo i ke ʻano o ka ʻenehana, ke ʻano hoʻonohonoho papa-luna, no laila e loaʻa iā ʻoe kahi ākea, nā kuhikuhi hana maʻalahi, no laila hiki iā ʻoe ke heluhelu.

Hōʻike no ka BGA Rework Station

Mana Mana: AC220V±10% 50/60HZ

Mana: 5.65KW(Max), ʻO ka wela wela (1.45KW)

ʻO ka mea wela lalo (1.2KW), IR Preheater (2.7KW), ʻē aʻe (0.3KW)

Nui PCB: 412*370mm(Max);6*6mm(Min)

BGA Chip Nui: 60*60mm(Max);2*2mm(Min)

IR Heater Nui: 285*375mm

ʻIke wela: 1 pcs

Ka Hana Hana: 7″ HD paʻi pā

Pūnaehana Mana: Pūnaehana hoʻomalu wela kūʻokoʻa V2 (kuleana lako polokalamu)

Pūnaehana Hōʻike: 15 ″ hōʻike ʻenehana SD (720P pale mua)

Nā Kūlana Kūlana: 2 miliona pixel SD Digital System System e noʻonoʻo nei i ka'ōnaehana o ka'ōnaehana

Hoʻomoʻa ʻana i ka ʻūhā: ʻakomi

Ka pololei o ka Alignment: ± 0.02mm

Mana Manawa: K-type thermocouple paʻa-loop mana me ka pololei a hiki i ±3 ℃

Mea Hanai: ʻAʻole

Hoʻonohonoho: V-groove me ka mea hoʻopili honua

Nui: L685 * W633 * H850mm

Kaumaha: 76KG