I ke kaʻina hana hoʻokomo SMT, pono pinepine ka hoʻohana ʻana i ka SMD adhesive, solder paste, stencil a me nā mea kōkua ʻē aʻe, kēia mau mea kōkua i ke kaʻina hana hana hui holoʻokoʻa SMT, ka maikaʻi o ka huahana, ka hana ʻana i ka hana koʻikoʻi.
1. Ka wā mālama (Shelf Life)
Ma lalo o nā kūlana i kuhikuhi ʻia, hiki i ka mea a i ʻole ka huahana ke hoʻokō i nā koi ʻenehana a mālama i ka hana kūpono o ka manawa mālama.
2. Manawa kau (Working Time)
Hoʻohana ʻia ka chip adhesive, solder paste ma mua o ka hoʻolaha ʻana i ke kaiapuni i ʻōlelo ʻia e mālama mau i nā mea kemika a me nā waiwai kino o ka manawa lōʻihi loa.
3. Viscosity (Viscosity)
Chip adhesive, solder paste i ka kulu maoli o na waiwai pili o ka lohi kulu.
4. Thixotropy (Thixotropy Ratio)
Loaʻa i ka chip adhesive a me ka solder paste nā hiʻohiʻona o ka wai ke hoʻokuʻu ʻia ma lalo o ke kaomi, a lilo koke i plastic paʻa ma hope o ka extrusion a i ʻole e hoʻōki i ke kau ʻana i ke kaomi.Kapa ʻia kēia ʻano he thixotropy.
5. Hoʻomoe (Slump)
Mahope o ka pai ana o kamīkini paʻi stencilma muli o ka ʻumekaumaha a me ka ʻili o ka ʻili a me ka piʻi ʻana o ka mahana a i ʻole ka lōʻihi o ka manawa kaʻa a me nā kumu ʻē aʻe i kumu ʻia e ka hoʻohaʻahaʻa kiʻekiʻe, ʻo ka ʻāpana lalo ma waho o ka palena i kuhikuhi ʻia o ka hanana slump.
6. Ka laha ana
ʻO ka lōʻihi o ka laha ʻana o ka mea hoʻopili i ka lumi wela ma hope o ka hāʻawi ʻana.
7. Hoʻopili (Tack)
ʻO ka nui o ka hoʻopili ʻana o ka solder paste i nā ʻāpana a me ka hoʻololi ʻana o kona adhesion me ka hoʻololi ʻana o ka manawa mālama ma hope o ka paʻi ʻana o ka paʻi solder.
8. Wetting (Wetting)
ʻO ka mea hoʻoheheʻe ʻia i loko o ka ʻili keleawe e hana i kahi kūlana ʻaʻahu, ʻoluʻolu a me ka haki ʻole o ka ʻāpana lahilahi solder.
9. No-clean Solder Paste (No-clean Solder Paste)
Solder paste i loaʻa i kahi ʻāpana o ke koena solder pōʻino ma hope o ke kūʻai ʻana me ka hoʻomaʻemaʻe ʻole i ka PCB.
10. Pākuʻi Solder Haʻahaʻa (Low Temperature Paste)
Solder paste me ka wela heheʻe ma lalo o 163 ℃.
Ka manawa hoʻouna: Mar-16-2022