41. PLC
ʻO ka mea lawe puʻupuʻu palaki me nā alakaʻi.ʻO kekahi o ka pūʻolo mauna ili.Hoʻopuka ʻia nā pine mai nā ʻaoʻao ʻehā o ka pūʻolo, ma ke ʻano o ka ding, a he mau huahana plastik.Ua hoʻohana mua ʻia e Texas Instruments ma ʻAmelika Hui Pū ʻIa no 64k-bit DRAM a me 256kDRAM, a i kēia manawa ua hoʻohana nui ʻia i nā kaʻapuni e like me ka logic LSIs a me DLDs (a i ʻole nā mea hana logic process).ʻO 1.27mm ka lōʻihi o ke kikowaena a me ka helu o nā pine mai 18 a 84. ʻAʻole hiki ke hoʻololi a maʻalahi ka hoʻohana ʻana o nā pine J-like ma mua o nā QFP, akā ʻoi aku ka paʻakikī o ka nānā ʻana ma hope o ke kūʻai ʻana.Ua like ka PLCC me LCC (ʻike ʻia ʻo QFN).Ma mua, ʻo ka ʻokoʻa wale nō ma waena o nā mea ʻelua ʻo ia ka mea i hana ʻia me ka plastic a me ka mea hope i hana ʻia i ka ceramic.Eia nō naʻe, aia nā pūʻolo J-like i hana ʻia me nā pūʻolo seramika a me nā pinless i hana ʻia me ka plastic (i hōʻailona ʻia he plastic LCC, PC LP, P-LCC, etc.), ʻaʻole hiki ke ʻike ʻia.
42. P-LCC (ka mea lawe ki'i kīko'o kī 'ole)
I kekahi manawa he inoa inoa ia no ka plastic QFJ, i kekahi manawa he inoa inoa ia no QFN (Plastic LCC) (e nānā i ka QFJ a me QFN).Hoʻohana kekahi mau mea hana LSI i ka PLCC no ka pūʻolo alakaʻi a me ka P-LCC no ka pūʻolo alakaʻi ʻole e hōʻike i ka ʻokoʻa.
43. QFH (pūʻolo kiʻekiʻe ʻehā ʻehā)
ʻĀpana paʻa paʻa me nā pine mānoanoa.He ʻano ʻilika QFP kahi i hana ʻia ai ke kino o ka QFP i ʻoi aku ka mānoanoa e pale ai i ka haki ʻana o ke kino pūʻolo (e nānā i ka QFP).ʻO ka inoa i hoʻohana ʻia e kekahi mau mea hana semiconductor.
44. QFI (quad flat I-leaded packgac)
ʻĀpana pāhaʻi I-leaded pūʻolo.ʻO kekahi o nā pūʻolo kau luna.Alakaʻi ʻia nā pine mai nā ʻaoʻao ʻehā o ka pūʻolo ma kahi ʻano I-like i lalo.Kāhea ʻia ʻo MSP (e nānā i ka MSP).Hoʻopili ʻia ka mauna i ka substrate i paʻi ʻia.No ka mea, ʻaʻole i puka mai nā pine, ʻoi aku ka liʻiliʻi o ka wāwae kau ma mua o ka QFP.
45. QFJ (pāpā J-leaded pūʻolo)
ʻĀpana pāhaʻi J-leaded pūʻolo.ʻO kekahi o nā pūʻolo kau luna.Alakaʻi ʻia nā pine mai nā ʻaoʻao ʻehā o ka pūʻolo ma ke ʻano J i lalo.ʻO kēia ka inoa i hōʻike ʻia e ka Hui Hana ʻElela a me Mechanical Manufacturers o Iapana.ʻO 1.27mm ka mamao o ke kikowaena.
ʻElua ʻano mea: plastic a me ka ceramic.Kapa ʻia nā Plastic QFJs he PLCC (e nānā i ka PLCC) a hoʻohana ʻia i nā kaapuni e like me microcomputers, hōʻike puka, DRAMs, ASSPs, OTPs, etc. Mai ka 18 a hiki i ka 84 nā helu pine.
ʻIke pū ʻia nā QFJ Ceramic ʻo CLCC, JLCC (e nānā i ka CLCC).Hoʻohana ʻia nā pūʻolo puka makani no nā EPROM e holoi ʻia e UV a me nā pōʻai microcomputer chip me nā EPROM.Mai ka 32 a i ka 84 ka helu pine.
46. QFN (pūʻolo alakaʻi ʻole quad flat)
ʻAha paʻa pāhaʻi pūʻolo alakaʻi ʻole.ʻO kekahi o nā pūʻolo kau luna.I kēia mau lā, ua kapa ʻia ʻo ia ʻo LCC, a ʻo QFN ka inoa i kuhikuhi ʻia e ka Japan Electrical and Mechanical Manufacturers Association.Hoʻolako ʻia ka pūʻolo me nā pilina electrode ma nā ʻaoʻao ʻehā, a no ka loaʻa ʻole o nā pine, ʻoi aku ka liʻiliʻi o ka wahi kau ma mua o QFP a ʻoi aku ke kiʻekiʻe ma mua o QFP.Eia nō naʻe, ke hoʻoulu ʻia ke koʻikoʻi ma waena o ka substrate i paʻi ʻia a me ka pūʻolo, ʻaʻole hiki ke hoʻomaha ʻia ma nā pilina electrode.No laila, paʻakikī ka hana ʻana i nā mea hoʻopili electrode e like me nā pine o QFP, ma ke ʻano maʻamau mai ka 14 a hiki i ka 100. ʻElua ʻano o nā mea: keramika a me ka plastic.ʻO nā kikowaena hoʻopili electrode he 1.27 mm kaawale.
ʻO ka Plastic QFN kahi pūʻolo kumu kūʻai haʻahaʻa me kahi kumu substrate paʻi epoxy aniani.Ma kahi o 1.27mm, aia kekahi 0.65mm a me 0.5mm electrode contact center mamao.Kapa ʻia kēia pūʻolo LCC plastic, PCLC, P-LCC, etc.
47. QFP (pūʻolo paʻa ʻehā)
ʻĀpana paʻa pāhaʻi.ʻO kekahi o nā pūʻolo mauna ʻili, alakaʻi ʻia nā pine mai nā ʻaoʻao ʻehā ma ke ʻano ʻēheu seagull (L).ʻEkolu ʻano o nā substrates: ceramic, metala a me ka plastic.Ma ke ʻano o ka nui, ʻo nā pūʻolo plastik ka hapa nui.ʻO nā Plastic QFP ka pūʻolo LSI multi-pin kaulana loa ke hōʻike ʻole ʻia ka mea.Hoʻohana ʻia ʻaʻole wale no nā kaʻapuni LSI logic kikohoʻe e like me nā microprocessors a me nā hōʻike ʻīpuka, akā no nā kaapuni LSI analog e like me ka hoʻoili ʻana i ka hōʻailona VTR a me ka hoʻoili leo leo.ʻO ka helu kiʻekiʻe loa o nā pine ma ka pitch waena 0.65mm he 304.
48. QFP (FP) (QFP fine pitch)
ʻO QFP (QFP fine pitch) ka inoa i kuhikuhi ʻia ma ka maʻamau JEM.E pili ana ia i nā QFP me kahi mamao kikowaena pine o 0.55mm, 0.4mm, 0.3mm, a pēlā aku ma lalo o 0.65mm.
49. QIC (pūʻolo ceramic quad in-line)
ʻO ka inoa o ka ceramic QFP.Hoʻohana kekahi mau mea hana semiconductor i ka inoa (e nānā i ka QFP, Cerquad).
50. QIP (quad in-line plastic package)
Alias no ka plastic QFP.Hoʻohana kekahi mau mea hana semiconductor i ka inoa (e nānā i ka QFP).
51. QTCP
ʻO kekahi o nā pūʻolo TCP, kahi i hana ʻia ai nā pine ma kahi lipine insulating a alakaʻi i waho mai nā ʻaoʻao ʻehā o ka pūʻolo.He pūʻolo lahilahi me ka hoʻohana ʻana i ka ʻenehana TAB.
52. QTP
ʻO ka pūʻolo lawe lipine ʻehā.ʻO ka inoa i hoʻohana ʻia no ka QTCP form factor i hoʻokumu ʻia e ka Japan Electrical and Mechanical Manufacturers Association ma ʻApelila 1993 (e ʻike iā TCP).
53、QUIL (hāhā i ka laina)
He inoa inoa no QUIP (e nānā i ka QUIP).
54. QUIP (pūʻolo laina ʻehā)
Puke laina laina ʻehā me ʻehā lālani pine.E alakaʻi ʻia nā pine mai nā ʻaoʻao ʻelua o ka pūʻolo a hoʻopaʻa ʻia a kūlou i lalo i ʻehā lālani kēlā me kēia.ʻO 1.27mm ka mamao kikowaena pine, ke hoʻokomo ʻia i loko o ka substrate i paʻi ʻia, lilo ka mamao kikowaena kikowaena i 2.5mm, no laila hiki ke hoʻohana ʻia i nā papa kaapuni maʻamau.He pūʻolo liʻiliʻi ma mua o ka DIP maʻamau.Hoʻohana ʻia kēia mau pūʻolo e NEC no nā ʻāpana microcomputer i nā kamepiula papapihi a me nā mea pono home.ʻElua ʻano mea: keramika a me ka plastic.ʻO ka helu o nā pine he 64.
55. SDIP (hōʻemi ʻelua pūʻolo laina laina)
ʻO kekahi o nā pūʻolo pahu pahu, ua like ke ʻano me DIP, akā ʻoi aku ka liʻiliʻi o ka mamao waena (1.778 mm) ma mua o DIP (2.54 mm), no laila ka inoa.ʻO ka helu o nā pine mai 14 a 90, a ua kapa ʻia hoʻi ʻo SH-DIP.ʻElua ʻano mea: keramika a me ka plastic.
56. SH-DIP (hōʻemi ʻelua pūʻolo laina laina)
E like me SDIP, ka inoa i hoʻohana ʻia e kekahi mau mea hana semiconductor.
57. SIL (hoʻokahi ma ka laina)
ʻO ka inoa inoa o SIP (e nānā i ka SIP).Hoʻohana nui ʻia ka inoa SIL e nā mea hana semiconductor ʻEulopa.
58. SIMM (hoʻokahi i-laina hoʻomanaʻo module)
Hoʻokahi module hoʻomanaʻo i loko o ka laina.He module hoʻomanaʻo me nā electrodes kokoke i hoʻokahi ʻaoʻao o ka substrate i paʻi ʻia.ʻO ka mea maʻamau e pili ana i ka mea i hoʻokomo ʻia i loko o kahi kumu.Loaʻa nā SIMM maʻamau me 30 electrodes ma 2.54mm mamao kikowaena a me 72 electrodes ma 1.27mm mamao waena.ʻO nā SIMM me 1 a me 4 megabit DRAM i nā pūʻolo SOJ ma hoʻokahi a ʻelua ʻaoʻao paha o kahi substrate i paʻi ʻia e hoʻohana nui ʻia i nā kamepiula pilikino, nā keʻena hana, a me nā mea hana ʻē aʻe.Ma kahi o 30-40% o nā DRAM i hōʻuluʻulu ʻia ma SIMM.
59. SIP (hoʻokahi pūʻolo ma ka laina)
pūʻolo laina hoʻokahi.E alakaʻi ʻia nā pine mai kekahi ʻaoʻao o ka pūʻolo a hoʻonohonoho ʻia i kahi laina pololei.I ka hui ʻana ma luna o kahi substrate i paʻi ʻia, aia ka pūʻolo i kahi kūlana kū ʻaoʻao.ʻO 2.54mm ka lōʻihi o ke kikowaena a me ka helu o nā pine mai 2 a 23, ʻo ka hapa nui i nā pūʻolo maʻamau.ʻOkoʻa ke ʻano o ka pūʻolo.Ua kapa ʻia kekahi mau pūʻolo me ke ʻano like me ZIP.
60. SK-DIP
He ʻano DIP.E pili ana ia i kahi DIP haiki me ka laula o 7.62mm a me kahi mamao kikowaena pine o 2.54mm, a ua kapa ʻia ʻo ia he DIP (e nānā i ka DIP).
61. SL-DIP (puʻi laina ʻelua i loko o ka laina)
He ʻano DIP.He DIP haiki ia me ka laula o 10.16mm a me kahi mamao kikowaena pine o 2.54mm, a ua kapa mau ia he DIP.
62. SMD (nā mea kau i luna)
Nā mea hoʻopaʻa i luna.I kekahi manawa, hoʻokaʻawale kekahi mau mea hana semiconductor i ka SOP me SMD (e ʻike i ka SOP).
63. SO (laina liʻiliʻi)
ʻO ka inoa inoa o SOP.Hoʻohana ʻia kēia inoa e nā mea hana semiconductor a puni ka honua.(E nana SOP).
64. SOI (puke alakai I-leaded liʻiliʻi)
ʻO ka pūʻolo laina waho liʻiliʻi koʻu ʻano pin.ʻO kekahi o nā ʻeke mauna ʻili.E alakaʻi ʻia nā pine i lalo mai nā ʻaoʻao ʻelua o ka pūʻolo ma kahi ʻano I-me ka mamao waena o 1.27mm, a ʻoi aku ka liʻiliʻi o ka wahi kau ma mua o ka SOP.Ka helu o nā pine 26.
65. SOIC (kaapuni hoʻohui laina waho liʻiliʻi)
ʻO ka inoa inoa o SOP (e nānā i ka SOP).Nui nā mea hana semiconductor haole i lawe i kēia inoa.
SOJ
pūʻolo kiko kiko liʻiliʻi J-like pin.ʻO kekahi o ka pūʻolo mauna ili.ʻO nā pine mai nā ʻaoʻao ʻelua o ka pūʻolo e alakaʻi i lalo i ke ʻano J, i kapa ʻia.ʻO nā mea hana DRAM i nā pūʻolo SO J i ʻākoakoa nui ʻia ma nā SIMM.ʻO 1.27mm ka mamao o ke kikowaena a me ka helu o nā pine mai 20 a 40 (e nānā iā SIMM).
67. SQL (Poloke alakaʻi L-alakaʻi liʻiliʻi waho-Line)
Wahi a ka JEDEC (Joint Electronic Device Engineering Council) maʻamau no SOP i hoʻopaʻa inoa ʻia (e ʻike iā SOP).
68. SONF
SOP me ka ʻole o ka wela, e like me ka SOP maʻamau.Hoʻohui ʻia ka māka NF (non-fin) e hōʻike i ka ʻokoʻa o nā pūʻolo IC mana me ka ʻole o ka wela.ʻO ka inoa i hoʻohana ʻia e kekahi mau mea hana semiconductor (e nānā i ka SOP).
69. SOF (pūʻolo laina waho liʻiliʻi)
Puke Kuhikuhi Li'ili'i.ʻO kekahi o nā pūʻolo mauna ʻili, alakaʻi ʻia nā pine mai nā ʻaoʻao ʻelua o ka pūʻolo i ke ʻano o nā ʻēheu seagull (L-like).ʻElua ʻano mea: plastic a me ka ceramic.ʻIke pū ʻia ʻo SOL a me DFP.
Hoʻohana ʻia ʻo SOP no ka LSI hoʻomanaʻo wale nō, akā no ka ASSP a me nā kaapuni ʻē aʻe ʻaʻole nui loa.ʻO SOP ka puʻupuʻu mauna ili kaulana loa ma ke kula kahi i ʻoi aku ai ka nui o nā mea hoʻokomo a me nā puka puka ma mua o 10 a 40. ʻO 1.27mm ka mamao o ke kikowaena pine, a ʻo ka helu o nā pine mai 8 a 44.
Eia kekahi, ua kapa ʻia nā SOP me ka mamao kikowaena pine ma lalo o 1.27mm;ʻO nā SOP me ke kiʻekiʻe o ka hui ma lalo o 1.27mm ua kapa ʻia ʻo TSOPs (e nānā i ka SSOP, TSOP).Aia kekahi SOP me ka wela wela.
70. SOW (Poloke Kuhikuhi Li'ili'i (Wide-Jype)
Ka manawa hoʻouna: Mei-30-2022