No ke aha e hana ai nā papa PCB i ka impedance?
Impedance - ʻoiaʻiʻo, e pili ana i ke kū'ē a me nā palena o ka lua o ka reactance, no ka mea, ʻo ka laina PCB e noʻonoʻo i ka hoʻokomo ʻana o nā mea uila, plug-in ma hope o ka noʻonoʻo ʻana o ka conductivity a me ka hoʻouna ʻana i ka hōʻailona hana a me nā pilikia ʻē aʻe, no laila. ʻAʻole hiki ke ʻae ʻia ʻo ka haʻahaʻa o ka impedance ʻoi aku ka maikaʻi, ʻoi aku ka haʻahaʻa o ka resistivity ma mua o ke kenimika square 1 × 10 o ka hōʻemi 6 mau manawa ma hope.
Ma ka ʻaoʻao ʻē aʻe, ʻo ka papa PCB i ke kaʻina hana e hele i loko o ke kahe keleawe, ka pā (a i ʻole ka hoʻoheheʻe kemika, a i ʻole ka wela wela), nā mea hoʻohui a me nā ʻāpana ʻē aʻe o ka loulou a me nā mea i hoʻohana ʻia i kēia loulou e hōʻoia i ka lalo. ʻO ka resistivity, i mea e hōʻoia ai i ka haʻahaʻa o ka impedance holoʻokoʻa o ka papa PCB i mea e hoʻokō ai i nā koi o ka maikaʻi o ka huahana, a i ʻole e hana maʻamau ka papa kaapuni.
'O ka 'oihana uila e like me ka holo'oko'a, PCB kaapuni papa hale hana i loko o ka tin-plating loulou i ka loa pilikia, o ka hopena o ka impedance o na ki loulou, no ka mea, o ka papa kaapuni tin-plating loulou, ua kaulana i kēia manawa e hoʻokō i ke kumu o tin-plating me ka hoʻohana ʻana i ka ʻenehana tin-plating kemika, akā ʻo mākou ka ʻoihana uila ma ke ʻano he mea e loaʻa ai ka ʻoihana uila, a i ʻole ka PCB papa hana a me ka ʻoihana hana no nā makahiki he 10 o ka hoʻopili ʻana a me ka nānā ʻana.
No ka ʻoihana uila, e like me ka laina o ka hoʻokolokolo ʻana, ʻo ka nāwaliwali loa o ka ʻili kemika he maʻalahi ke wehe ʻia (maʻalahi ka oxidation a i ʻole deliquescence), hiki i ka brazing maikaʻi ke paʻakikī i ka weld, kiʻekiʻe loa ka impedance e alakaʻi i ka conductivity maikaʻi ʻole. ka holoʻokoʻa o ka papa hana instability, maʻalahi ka ulu ʻana i nā whiskers tin e alakaʻi i ka laina PCB pōkole a i ʻole ke ahi a i ʻole nā hanana ahi.
ʻO ka laina nui o ka papa kaapuni PCB he keleawe foil, keleawe foil i loko o nā hui solder ka papa tin, a me nā mea uila ma o ka solder paste (a i ʻole solder line) welded ma luna o ka papa tin, ʻoiaʻiʻo, solder paste i loko o ka. ka hoohehee ana i na mea elela a me ka papa pa'i ma waena o ka metala ('o ia ho'i, conductive metala monomers), no laila, he mea ma'alahi a ma'alahi ke kuhikuhi 'ana ua uhi 'ia na mea 'elepona me ka papa me ka lalo o ka PCB. papa a laila ka Copper foil Connection.
No laila, ʻo ka maʻemaʻe o ka papa hoʻoheheʻe tin a me kona impedance ke kī;akā, ʻaʻole ma mua o ka hoʻopili ʻana o nā ʻāpana uila, pololei me ka mea kani e ʻike i ka impedance, ʻoiaʻiʻo, ʻo ka ʻimi mea hana (a ʻike ʻia ʻo ka peni mika) e hoʻopau pū ʻia ma o ka pilina mua me ka papa kaapuni ma lalo o ka ʻili. ʻO ka pahu keleawe o ka papa hoʻoheheʻe tin a laila me ka lalo o ka PCB papa keleawe foil e hoʻohui i kēia manawa.No laila, ʻo ka uhi kī ke kī, ʻo ia ke kī e hoʻopili i ka impedance a pili i ka hana o ka papa kaapuni, akā maʻalahi hoʻi e mālama ʻole ʻia ke kī.
Ma waho aʻe o nā monomers metala, ʻo kā lākou pūhui he mau conductors maikaʻi ʻole o ka uila a i ʻole nā mea hana ʻole (ʻo ia hoʻi ma muli o ke ʻano o ka hiki ke hāʻawi i ka laina a i ʻole ka hiki ke hoʻouna ʻia o ke kī), no laila ke ʻano o ka papa paʻa i ke alo o kēia. ke ʻano o nā pūhui conductive a me nā hui ʻole a i ʻole nā hui pū ʻana o ka tin, kona resistivity i mākaukau a i ʻole ka hoʻoheheʻe ʻana i ka wā e hiki mai ana, kiʻekiʻe loa ka hopena electrolytic o ka makū a me kona resistivity a me ka impedance e pili ana (hiki ke hoʻopili i ke kiʻekiʻe a i ʻole ka hoʻouna ʻana i ka hōʻailona o nā kaapuni kikohoʻe. ).pae a i ʻole ka hoʻouna ʻana i ka hōʻailona ma nā kaapuni kikohoʻe), a ʻaʻole kūlike kona ʻano impedance.Hoʻopili kēia i ka hana o ka papa kaapuni a me ka mīkini holoʻokoʻa.
Ma nā ʻōlelo o ka hanana kaiapili o kēia manawa, ʻo ka papa pcb ma ka lalo o ka mea plating a me ka hana e hoʻopili i nā hiʻohiʻona o ka papa PCB o ka impedance o ke kumu nui loa a me ke kumu pololei loa, akā no ka plating me ka ʻelemakule. a me ka moisture electrolysis o ka loli o ka impedance i kona impedance e hana i ka hopohopo e pili ana i ka hopena o ka hopena o ka oi huna a me ka loli, a me ke kumu nui o kona huna ana aia ma keia: maka olohelohe, a me ka lua ole hiki ke ana mau, no ka mea, me ka manawa a me ka ambient humidity a me ka hoʻololi o ka impedance o ka papa a me ka hana o ka mīkini.No ka mea, loaʻa iā ia ka ʻokoʻa me ka loli o ka manawa a me ka haʻahaʻa o ke kaiapuni, no laila ua maʻalahi ka mālama ʻole ʻia.
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Ka manawa hoʻouna: Sep-08-2023