He aha ka HDI Circuit Board?

I. He aha ka papa HDI?

ʻO ka papa HDI (High Density Interconnector), ʻo ia hoʻi, ka papa interconnect kiʻekiʻe, ʻo ia ka hoʻohana ʻana i ka ʻenehana micro-blind buried hole, kahi papa kaapuni me kahi kiʻekiʻe kiʻekiʻe o ka māhele laina.ʻO ka papa HDI he laina i loko a me waho laina, a laila ka hoʻohana ʻana i ka wili, hole metallization a me nā kaʻina hana ʻē aʻe, i kēlā me kēia papa o ka laina pili i loko.

II.ka ʻokoʻa ma waena o ka papa HDI a me ka PCB maʻamau

Hana ʻia ka papa HDI me ka hoʻohana ʻana i ke ʻano o ka hōʻiliʻili ʻana, ʻoi aku ka nui o nā papa, ʻoi aku ka kiʻekiʻe o ka pae ʻenehana o ka papa.ʻO ka papa HDI maʻamau he 1 manawa laminated, HDI kiʻekiʻe kiʻekiʻe e hoʻohana ana i ka ʻenehana lamination, ʻoiai ka hoʻohana ʻana i nā lua i hoʻopaʻa ʻia, ka hoʻopiha ʻana i nā lua, ka hoʻopaʻa ʻana i ka laser a me nā ʻenehana PCB holomua.Ke piʻi aʻe ka mānoanoa o ka PCB ma mua o ka papa ʻewalu papa, ʻoi aku ka haʻahaʻa o ke kumukūʻai o ka hana ʻana me HDI ma mua o ke kaʻina hana paʻakikī paʻakikī.

ʻOi aku ka kiʻekiʻe o ka hana uila a me ka hōʻailona pololei o nā papa HDI ma mua o nā PCB maʻamau.Eia kekahi,ʻoi aku ka maikaʻi o nā papa HDI no RFI, EMI, static discharge, thermal conductivity, etc. Hiki i kaʻenehana High Density Integration (HDI) ke hoʻonui i ka hoʻolālā huahana hopena, i ka wā e hālāwai ai i nā kūlana kiʻekiʻe o ka hana uila a me ka pono.

III.nā mea papa HDI

Hāʻawi nā mea HDI PCB i kekahi mau koi hou, me ka ʻoi aku ka maikaʻi o ka dimensional stability, anti-static mobility a me ka non-adhesive.ʻO nā mea maʻamau no HDI PCB ʻo RCC (resin-coated copper).aia ʻekolu ʻano RCC, ʻo ia ka polyimide metalized film, polyimide film, a me ka hoʻolei polyimide film.

ʻO nā mea maikaʻi o RCC: ka mānoanoa liʻiliʻi, ke kaumaha māmā, ka maʻalahi a me ka flammability, nā hiʻohiʻona hoʻohālikelike impedance a me ke kūpaʻa dimensional maikaʻi loa.Ma ke kaʻina hana o HDI multilayer PCB, ma kahi o ka pepa hoʻopaʻa kuʻuna a me ka foil keleawe ma ke ʻano he insulating medium a conductive layer, hiki ke kāohi ʻia ʻo RCC e nā ʻenehana suppression maʻamau me nā chips.ʻAʻole hoʻohana ʻia nā ʻano hana hoʻoheheʻe ʻole e like me ka laser i mea e hana ai i nā interconnections micro-through-hole.

Hoʻokuʻu ʻo RCC i ka hanana a me ka hoʻomohala ʻana o nā huahana PCB mai SMT (Surface Mount Technology) a i CSP (Chip Level Packaging), mai ka hoʻoheheʻe mechanical a hiki i ka hoʻoheheʻe ʻana i ka laser, a paipai i ka hoʻomohala ʻana a me ka holomua o PCB microvia, nā mea āpau i lilo i mea alakaʻi HDI PCB. no RCC.

Ma ka PCB maoli i loko o ka manufacturing kaʻina hana, no ke koho ana o RCC, he mau FR-4 maʻamau Tg 140C, FR-4 kiʻekiʻe Tg 170C a me FR-4 a me Rogers hui laminate, ka mea i hoʻohana nui i kēia mau lā.Me ka hoʻomohala ʻana o ka ʻenehana HDI, pono nā mea HDI PCB e hoʻokō i nā koi hou aʻe, no laila pono nā ʻano nui o nā mea HDI PCB.

1. ʻO ka hoʻomohala ʻana a me ka hoʻohana ʻana i nā mea maʻalahi me ka hoʻohana ʻole ʻana i nā mea hoʻopili

2. Li'ili'i dielectric papa mānoanoa a me ka liilii deviation

3 .ka hoʻomohala ʻana o LPIC

4. Li'ili'i a li'ili'i mau dielectric mau

5. ʻO nā poho dielectric liʻiliʻi a liʻiliʻi

6. Kiʻekiʻe solder paʻa

7. Paʻa pono me CTE (koefficient of thermal expansion)

IV.ka noi o ka ʻenehana hana papa HDI

ʻO ka paʻakikī o ka hana ʻana o HDI PCB he micro ma o ka hana ʻana, ma o ka metallization a me nā laina maikaʻi.

1. Ka hana ʻana o ka micro-through-hole

ʻO ka hana micro-through-hole ka pilikia nui o ka hana HDI PCB.ʻElua mau ʻano hana wili nui.

a.No ka hoʻoheheʻe ʻana ma waena o ka lua, ʻo ka wili mīkini ʻoi mau ke koho maikaʻi loa no kāna hana kiʻekiʻe a me ke kumu kūʻai haʻahaʻa.Me ka hoʻomohala ʻana o ka mana mīkini mīkini, ke ulu nei kāna noi i ka micro-through-hole.

b.ʻElua ʻano o ka hoʻoheheʻe laser: photothermal ablation a me photochemical ablation.ʻO ka mea mua e pili ana i ke kaʻina hana o ka hoʻomehana ʻana i ka mea hana e hoʻoheheʻe a hoʻoheheʻe ʻia ma o ka puka puka i hana ʻia ma hope o ka lawe ʻana o ka ikehu kiʻekiʻe o ka laser.ʻO ka mea hope e pili ana i ka hopena o nā kiʻi kiʻekiʻe-ikaika ma ka māhele UV a me ka lōʻihi o ka laser ma mua o 400 nm.

ʻEkolu ʻano ʻōnaehana laser i hoʻohana ʻia no nā paneli maʻalahi a paʻa, ʻo ia hoʻi ka excimer laser, UV laser drilling, a me CO 2 laser.ʻAʻole kūpono ka ʻenehana laser no ka wili ʻana, akā no ka ʻoki ʻana a me ka hana ʻana.Ke hana nei kekahi mau mea hana i ka HDI ma ka laser, a ʻoiai he kumukūʻai nā mea hana wili laser, hāʻawi lākou i ka pololei kiʻekiʻe, nā kaʻina hana paʻa a me ka ʻenehana hōʻoia.ʻO ka maikaʻi o ka ʻenehana laser ʻo ia ke ala maʻamau i hoʻohana ʻia i ka hana makapō / kanu ʻia i loko o ka lua.I kēia lā, loaʻa ka 99% o nā puka microvia HDI e ka hoʻoheheʻe laser.

2. Ma o ka metallization

ʻO ka paʻakikī nui loa i ka metallization ma loko o ka puka ka paʻakikī i ka loaʻa ʻana o ka plating like.No ka 'enehana hole plating hohonu o micro-ma o nā lua, ma ka hoʻohana 'ana i ka plating solution me ka kiʻekiʻe dispersion hiki ke hoʻonui i ka plating solution ma ka plating device i ka manawa, hiki ke hanaʻia e ka ikaika mechanical stirring a vibration, ultrasonic stirring, a hoʻopāpā ʻana.Eia kekahi, pono e hoʻonui ʻia ka haʻahaʻa o ka pā ma loko o ka lua ma mua o ka hoʻopaʻa ʻana.

Ma waho aʻe o ka hoʻomaikaʻi ʻana i ke kaʻina hana, ua ʻike nā ʻano hana metallization HDI i nā ʻenehana nui: chemical plating additive technology, straight plating technology, etc.

3. Laina maikai

ʻO ka hoʻokō ʻana i nā laina maikaʻi e pili ana i ka hoʻoili kiʻi maʻamau a me ke kiʻi laser pololei.ʻO ka hoʻoili kiʻi maʻamau ka hana like me ke kalai kemika maʻamau e hana i nā laina.

No ke kiʻi kiʻi pololei laser, ʻaʻohe kiʻi kiʻi i koi ʻia, a ua hoʻokumu ʻia ke kiʻi ma luna o ke kiʻi photosensitive e ka laser.Hoʻohana ʻia ke kukui hawewe UV no ka hana ʻana, e hiki ai i nā ʻōnaehana mālama wai e hoʻokō i nā koi o ka hoʻonā kiʻekiʻe a me ka hana maʻalahi.ʻAʻole koi ʻia ke kiʻi kiʻiʻoniʻoni e pale aku i nā hopena maikaʻi ʻole ma muli o nā hemahema o ke kiʻiʻoniʻoni, e ʻae ana i ka hoʻopili pololei ʻana iā CAD/CAM a me ka hoʻopōkole ʻana i ka pōʻaiapili hana, e kūpono ai no nā holo hana liʻiliʻi a nui.

ʻO Zhejiang NeoDen Technology Co., LTD., i hoʻokumu ʻia i ka makahiki 2010, he mea hana ʻoihana loea i ka mīkini koho SMT a me kahi mīkini,reflow umu, mīkini paʻi stencil, laina hana SMT a me nā mea ʻē aʻeNā huahana SMT.Loaʻa iā mākou kā mākou hui R&D ponoʻī a me ka hale hana ponoʻī, e hoʻohana ana i kā mākou R&D ʻike waiwai ponoʻī, hoʻomaʻamaʻa maikaʻi ʻia, lanakila maikaʻi ʻia mai nā mea kūʻai aku o ka honua.

I kēia ʻumi makahiki, hoʻomohala kūʻokoʻa mākou iā NeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 a me nā huahana SMT ʻē aʻe, i kūʻai maikaʻi ʻia ma ka honua holoʻokoʻa.

Ke manaʻoʻiʻo nei mākou he poʻe maikaʻi a me nā hoa hana ʻo NeoDen i ʻoihana maikaʻi a ʻo kā mākou kūpaʻa i ka Innovation, Diversity and Sustainability e hōʻoia i ka loaʻa ʻana o ka automation SMT i kēlā me kēia mea hobbyist ma nā wahi āpau.