He aha ka hana a ka Mīkini SMT AOI?

SMT AOI Mīkiniwehewehe

ʻO ka ʻōnaehana AOI he ʻōnaehana kiʻi ʻoniʻoni maʻalahi a me ka ʻōnaehana hana i hoʻohui ʻia me nā kamera, nā lens, nā kumu kukui, nā kamepiula a me nā mea hana maʻamau.Ma lalo o ka hoʻomālamalama ʻana o ke kumu kukui, hoʻohana ʻia ke kāmela no ke kiʻi kiʻi pololei, a laila ʻike ʻia ka ʻike e ka hana kamepiula.ʻO nā mea maikaʻi o kēia ʻōnaehana maʻalahi he kumukūʻai haʻahaʻa, hoʻohui maʻalahi, paepae ʻenehana haʻahaʻa haʻahaʻa, i ka hana hana hiki ke pani i ka nānā lima, e hoʻokō i nā koi o ka hapa nui o nā manawa.
 

Ma hea e waiho ai ka mīkini SMT AOI?

(1) Ma hope o ka paʻi ʻana i ka solder paste.Inā hoʻokō ke kaʻina hana paʻi solder paste i nā koi, hiki ke hoʻemi nui ʻia ka helu o nā hemahema i loaʻa e ICT.ʻO nā hemahema paʻi maʻamau, penei:

a.ʻAʻole lawa ka solder ma ka papa.

b.Nui loa ka solder ma ka pad.

c.ʻAʻohe kūpono o ka solder i ka pad.

d.ʻO ke alahaka kūʻai ma waena o nā pads.

(2) Ma muareflow umu.Hana ʻia ka nānā ʻana ma hope o ka hoʻopili ʻana o nā mea i loko o ka paʻi ma ka papa a ma mua o ka hānai ʻia ʻana o ka PCB i loko o ka umu reflux.He wahi maʻamau kēia e waiho ai i ka mīkini nānā, ʻoiai ʻo ia kahi e ʻike ai ka hapa nui o nā hemahema mai ka paʻi solder paste a me ka hoʻokomo ʻana i ka mīkini.Hāʻawi ka ʻike hoʻomalu kaʻina hana nui i hana ʻia ma kēia wahi i ka ʻike calibration no nā mīkini wafer kiʻekiʻe a me nā mea hoʻopili paʻa.Hiki ke hoʻohana ʻia kēia ʻike no ka hoʻololi ʻana i ka hoʻokomo ʻana a i ʻole e hōʻike i ka pono o ka laminator e calibrated.ʻO ka nānā ʻana i kēia kūlana e hoʻokō i ka pahuhopu o ke kaʻina hana.

(3) Ma hope o ka reflow wiliwili.ʻO ka nānā ʻana ma ka pau ʻana o ke kaʻina hana SMT ka koho kaulana loa no AOI no ka mea ma laila e ʻike ʻia ai nā hewa hui āpau.Hāʻawi ka nānā ʻana ma hope o ka reflow i kahi kiʻekiʻe o ka palekana no ka mea e ʻike ai i nā hewa i hoʻokumu ʻia e ka paʻi paʻi solder, kau ʻana o nā mea, a me nā kaʻina hana reflow.
NeoDen SMT AOI mīkini kiko'ī

ʻO ka ʻōnaehana nānā ʻana no ka paʻi ʻana: ma hope o ka paʻi ʻana i ka stencil, pre/post reflow umu, pre/post wave soldering, FPC etc.

Ke ʻano papahana: Hoʻopololei lima, hoʻonohonoho kaʻa, lawe mai i ka ʻikepili CAD

Nā mea nānā:

1) Paʻi Stencil: ʻAʻole i loaʻa ka mea kūʻai aku, lawa ʻole a ʻoi aku ka nui o ka solder, misalignment solder, bridging, stain, scratch etc.

2) Nā hemahema o nā mea: nalo a ʻoi aku paha ka ʻāpana, misalignment, uneven, edging, kū'ē i ke kau ʻana, hewa a i ʻole nā ​​​​mea ʻino, etc.

3) DIP: Nalo nā ʻāpana, nā ʻāpana pōʻino, offset, skew, inversion, etc

4) Kuʻekuʻe ʻino: ʻoi aku ka nui a i ʻole ka nalo ʻana o ka solder, ke kūʻai ʻole ʻana, ka hoʻopili ʻana, ka pōlele solder, IC NG, ke keleawe keleawe etc.