Noi oSMT X-ray inspect machine- Ho'āʻo Chips

ʻO ke kumu a me ke ʻano o ka hoʻāʻo chip

ʻO ke kumu nui o ka hoʻāʻo ʻana i ka chip ʻo ka ʻike ʻana i nā mea e pili ana i ka maikaʻi o ka huahana i ke kaʻina hana i ka wā hiki loa a me ka pale ʻana i ka hana ʻana i waho o ka hoʻomanawanui, hoʻoponopono a me ka ʻōpala.He ala koʻikoʻi kēia o ka mālama ʻana i ka maikaʻi kaʻina huahana.Hoʻohana ʻia ka ʻenehana nānā X-RAY me ka fluoroscopy kūloko no ka nānā ʻole ʻana a hoʻohana mau ʻia e ʻike i nā hemahema like ʻole i loko o nā puʻupuʻu chip, e like me ka peeling layer, rupture, voids and lead bond integrity.Eia kekahi, hiki i ka X-ray nondestructive inspection ke nānā aku i nā hemahema e hiki mai ana i ka wā o ka hana ʻana o PCB, e like me ka alignment maikaʻi ʻole a i ʻole ka wehe ʻana o ke alahaka, nā pōkole a i ʻole nā ​​mea pili ʻole, a ʻike i ka pono o nā pōpō solder i loko o ka pūʻolo.ʻAʻole ia e ʻike wale i nā hui solder ʻike ʻole, akā ke kālailai pū ʻia i nā hopena inspectively qualitatively a quantitatively no ka ʻike mua ʻana i nā pilikia.

ʻO ke kumu noʻonoʻo chip o ka ʻenehana X-ray

Hoʻohana nā mea nānā X-RAY i kahi paipu X-ray no ka hoʻopuka ʻana i nā kukui X ma o ka laʻana chip, i kuhi ʻia ma ka mea lawe kiʻi.Hiki ke hoʻonui ʻia kona kiʻi kiʻi kiʻekiʻe e 1000 mau manawa, no laila e ʻae ʻia ke ʻano o loko o ka puʻupuʻu e hōʻike maopopo ʻia, e hāʻawi ana i kahi ala kūpono o ka nānā ʻana e hoʻomaikaʻi i ka "hoʻokahi-ma waena" a e hoʻokō i ka pahuhopu o "zero. nā hemahema”.

ʻO kaʻoiaʻiʻo, i ke alo o ka mākeke ke nānā aku i ka ʻoiaʻiʻo akā ʻo ke ʻano o loko o kēlā mau ʻāpana he mau hemahema, maopopo ʻaʻole hiki ke ʻike ʻia me ka maka ʻōlohelohe.Ma lalo o ka nānā X-ray wale nō e hōʻike ʻia ai ka "prototype".No laila, hāʻawi nā lako hoʻāʻo X-ray i ka hōʻoia kūpono a hoʻokani i kahi hana koʻikoʻi i ka hoʻāʻo ʻana i nā chips i ka hana ʻana i nā huahana uila.

Nā pōmaikaʻi o ka mīkini PCB x ray

1. ʻO ka nui o ka uhi ʻana o nā hemahema kaʻina a hiki i 97%.ʻO nā hemahema i hiki ke nānā ʻia, ʻo ia hoʻi: kūʻai kūʻai wahaheʻe, pili alahaka, kūpaʻa papa, kūʻai ʻole ʻole, nā lua ea, leakage mea a pēlā aku.ʻO ka mea kūikawā, hiki i ka X-RAY ke nānā i ka BGA, CSP a me nā mea huna ʻē aʻe.

2. ʻOi aku ka uhi hoʻāʻo kiʻekiʻe.ʻO X-RAY, nā mea nānā i ka SMT, hiki ke nānā i nā wahi i hiki ʻole ke nānā ʻia e ka maka ʻōlohelohe a me ka hoʻāʻo ʻana i ka laina.No ka laʻana, ua hoʻoholo ʻia ka PCBA he hewa, i manaʻo ʻia ʻo ia ka PCB i loko o ka papa alignment break, hiki ke nānā koke ʻia ʻo X-RAY.

3. Hoʻemi nui ʻia ka manawa hoʻomākaukau hoʻāʻo.

4. Hiki ke nānā i nā hemahema ʻaʻole hiki ke ʻike pono ʻia e nā ʻano hoʻāʻo ʻē aʻe, e like me: hoʻopunipuni hoʻopunipuni, nā lua ea a me ka hoʻoheheʻe maikaʻi ʻana.

5. ʻO nā lako nānā X-RAY no nā ʻaoʻao ʻelua a me nā papa multilayer hoʻokahi wale nō (me ka hana delamination).

6. Hāʻawi i ka ʻike ana kūpono i hoʻohana ʻia e loiloi i ke kaʻina hana ma SMT.E like me ka mānoanoa solder paste, ka nui o ka solder ma lalo o ka solder joint, etc.