1. Ke kumu hana hou: ʻaʻole i loaʻa nā palapala hoʻolālā a me nā lula, ʻaʻole i ʻae ʻia e like me nā ʻōlelo kūpono, ʻaʻohe protocol kaʻina hana hana hou.
2. ʻO ka helu o ka hana hou i ʻae ʻia no kēlā me kēia hui solder: ʻae ʻia ka hana hou ʻana no nā hui solder hemahema, a ʻaʻole ʻoi aku ka nui o ka hana hou ʻana no kēlā me kēia hui solder, inā ʻaʻole e pōʻino ka ʻāpana solder.
3. ʻO ka hoʻohana ʻana i nā ʻāpana i wehe ʻia: ʻaʻole pono e hoʻohana hou ʻia nā ʻāpana i wehe ʻia, inā pono ʻoe e hoʻohana, pono e like me nā waiwai uila o nā ʻāpana a me ke kaʻina hana screening test, e hoʻokō i nā koi ma mua o ka ʻae ʻana i ke kau ʻana.
4. ʻO ka helu o ka desoldering ma kēlā me kēia pā: ʻo kēlā me kēia papa i paʻi ʻia he hana desoldering wale nō (ʻo ia hoʻi, e ʻae wale i hoʻokahi pani o nā ʻāpana), kahi mānoanoa solder joint intermetallic compound (IMC) mānoanoa o 1.5 a 3.5µm, e ulu ka mānoanoa ma hope o ka hoʻoheheʻe ʻana, a hiki i 50µm, lilo ka hui solder i palupalu, emi ka ikaika wili, aia nā pilikia hilinaʻi koʻikoʻi ma lalo o nā kūlana vibration;a me ka remelting IMC e pono ai ke kiʻekiʻe o ka mahana, inā ʻaʻole hiki ke wehe i ka IMC.ʻO ka ʻāpana keleawe ma ka puka ʻana o ka puka puka ʻoi aku ka lahilahi, a ʻoi aku ka maʻalahi o ka paʻa i ka haki ʻana ma hope o ka hoʻoheheʻe ʻana;me ka hoʻonui wela o ka Z-axis, hoʻololi ka papa keleawe, a hemo ka pad ma muli o ke keakea ʻana o ka hui solder lead-tin.Lead-free hihia e huki i ka pad holoʻokoʻa: PCB ma muli o ke aniani fiber a me ka epoxy resin me ka wai mahu, ma hope o ka wela delamination: nui kuʻihao, ka pad mea oluolu e buckle, a me ka substrate kaawale.
5. Ka mauna o luna a me ka hui pu ana PCBA hui ma hope o ke kuʻiʻana kulou a me ka distortion koi: ili mauna a me ka hui hui ana PCBA hui ma hope o kuʻo kuoʻo kulou a me ka distortion o emi ma mua o 0.75% o na koi.
6. Huina helu o ka PCB hui hooponopono: ka huina o ka hooponopono ana o ka PCB anaina ua kaupalena 'ia i eono, oi loa rework a me ka hoololi e pili i ka hilinaʻi.
Ka manawa hoʻouna: Sep-23-2022