He aha nā pōmaikaʻi o ka ʻenehana hana SMT?

Kaʻina hana SMT:

ʻO ka mua ma ka ʻili o ka papa kaapuni paʻi solder coating solder paste, hou memīkini SMTnā ʻāpana o ka pahu metala a i ʻole ka pine pololei ma ka papa hoʻopaʻa ʻana o ka solder paste, a laila kau i ka PCB me nā ʻāpana i kareflow umuwela a pau i ka hehee ana i ka solder paste, ma hope o ka hooluolu ana, solder paste, solder curing i ike ia ma waena o na mea a me ka pai kaapuni o mechanical and electrical connections.He aha nā pōmaikaʻi o ka ʻenehana hana SMT?

I. ʻO ka hilinaʻi kiʻekiʻe a me ke kūpaʻa vibration ikaika

Hoʻohana ʻia ka hana SMT i nā ʻāpana chip, hilinaʻi kiʻekiʻe, mea liʻiliʻi a māmā hoʻi, no laila ua ikaika ke kūpaʻa haʻalulu, me ka hoʻohana ʻana i ka hana automated, me ka hilinaʻi kiʻekiʻe, ʻoi aku ka liʻiliʻi o ka hui solder ma lalo o hoʻokahi ma mua o ʻumi tausani, ʻoi aku ka haʻahaʻa ma mua o ka nalu o ka hole plugging component. ʻenehana kūʻai ʻana i kahi kauoha o ka nui, e hōʻoia i ka haʻahaʻa o nā huahana uila a i ʻole nā ​​​​mea hoʻohui solder hui defect rate, I kēia manawa, aneane 90% o nā huahana uila e hoʻohana i ka ʻenehana SMT.

II.He liʻiliʻi ka nui o nā huahana uila a kiʻekiʻe i ka nui o ka hui

ʻO ka nui a me ke kaumaha o nā ʻāpana SMT ma kahi o 1/10 wale nō o nā ʻāpana plug-in kuʻuna.ʻO ka maʻamau, hiki i ka ʻenehana SMT ke hoʻemi i ka nui a me ke kaumaha o nā huahana uila e 40% -60% a me 60% -80%, kēlā me kēia.ʻO ka ʻōnaehana SMT SMT a me nā ʻāpana ʻāpana hui mai 1.27mm a hiki i kēia manawa 0.63mm grid, ʻo kekahi a hiki i ka 0.5mm grid, ma o ka ʻenehana hoʻokomo lua e hoʻokomo i nā ʻāpana, hiki ke hoʻonui i ka nui o ka hui.

III.ʻO nā hiʻohiʻona alapine kiʻekiʻe, hana hilinaʻi

Ma muli o ka hoʻopili paʻa ʻana o nā ʻāpana chip, ʻo ka mea maʻamau ke alakaʻi ʻole a pōkole paha, e hōʻemi ana i ka mana o ka inductance parasitic a me ka capacitance parasitic, hoʻomaikaʻi i nā hiʻohiʻona kiʻekiʻe o ke kaapuni, a hōʻemi i ka hoʻopili electromagnetic a me rf.Loaʻa i nā kaʻapuni i hoʻolālā ʻia ʻo SMC a me SMD he 3GHz kiʻekiʻe loa, ʻoiai ʻo nā ʻāpana chip he 500MHz wale nō, hiki ke hoʻopōkole i ka manawa lohi o ka lawe ʻana.Hiki ke hoʻohana ʻia i nā kaapuni me ke alapine uaki ma luna o 16MHz.Me ka ʻenehana MCM, hiki ke piʻi i ka 100MHz ke alapine kiʻekiʻe o ka uaki hope loa o ka hana kamepiula, a hiki ke hoʻemi ʻia ka hoʻohana ʻana i ka mana e nā parasitic reactance e 2-3 mau manawa.

IV.Hoʻonui i ka huahana a hoʻomaopopo i ka hana maʻalahi

No ka hoʻopiha piha ʻana, pono ke kau ʻana i ka PCB perforated i kēia manawa he 40% hoʻonui i ka wahi o ka PCB kumu i hiki i ke poʻo hui o ka plug-in ʻakomi ke hoʻokomo i ka ʻāpana, inā ʻaʻole lawa ka wahi e wāwahi ai i ka ʻāpana.Hoʻohana ka mīkini SMT maʻalahi (SM421/SM411) i ka ʻūhā nozzle nozzle a me ka mea hoʻokuʻu, ʻoi aku ka liʻiliʻi o ka nozzle ma mua o ka hiʻohiʻona, akā e hoʻomaikaʻi i ka nui o ka hoʻonohonoho ʻana.ʻO kaʻoiaʻiʻo, hoʻopuka ʻia nā mea liʻiliʻi a me ka spacing spacing QFP e ka mīkini SMT maʻalahi e hoʻokō i ka hana piha piha.

V. E hoemi i na lilo a me na lilo

1. Ho'emi 'ia ka wahi ho'ohana o ka papa i pa'i 'ia, a 'o ka 1/12 ka wahi o ka 'enehana through-hole.Inā hoʻokomo ʻia ka CSP, e hoʻemi nui ʻia ka wahi.

2. Hoʻemi ʻia ka helu o nā lua wili ma ka papa i paʻi ʻia e mālama i nā kumukūʻai hoʻoponopono.

3. Ma muli o ka hoʻomaikaʻi ʻana i nā hiʻohiʻona alapine, ua hoʻemi ʻia ke kumukūʻai o ka debug kaapuni.

4. Ma muli o ka liʻiliʻi liʻiliʻi a me ke kaumaha māmā o nā ʻāpana chip, ua hoʻemi ʻia ke kumukūʻai o ka pahu, ka lawe ʻana a me ka mālama ʻana.

5. Hiki i ka ʻenehana hana SMT SMT ke hoʻopakele i nā mea waiwai, ikehu, mea hana, manpower, manawa, a me nā mea ʻē aʻe, hiki ke hōʻemi i nā kumukūʻai a hiki i 30% -50%.