He aha nā pōmaikaʻi a me nā pōʻino o ka BGA Packaged?

I. BGA pūʻolo kaʻina hana me ka kiʻekiʻe loa kuʻihao koi ma PCB hana.ʻO kāna mau pōmaikaʻi penei:
1. Pin pōkole, kiʻekiʻe hui haʻahaʻa, inductance parasitic liʻiliʻi a me ka capacitance, hana uila maikaʻi loa.
2. Hoʻohui kiʻekiʻe loa, nā pine he nui, ka spacing pine nui, coplanar pin maikaʻi.ʻO 0.3mm ka palena o ka spacing pine o ka electrode QFP.I ka hui ʻana i ka papa kaapuni welded, ʻoi aku ka koʻikoʻi o ke kau ʻana o ka chip QFP.ʻO ka hilinaʻi o ka pilina uila e koi i ka hoʻomanawanui ʻana he 0.08mm.ʻO nā pine electrode QFP me ka ʻokoʻa liʻiliʻi he lahilahi a palupalu, maʻalahi ke wili a wāwahi paha, pono e hōʻoia ʻia ka like a me ka planarity ma waena o nā pine papa kaapuni.I ka hoʻokaʻawale ʻana, ʻo ka pōmaikaʻi nui loa o ka pūʻolo BGA ʻo ia ka nui o ka 10-electrode pin spacing, typical spacing is 1.0mm.1.27mm,1.5mm (Inch 40mil, 50mil, 60mil), ʻo ke kau ʻana o ka hoʻomanawanui he 0.3mm, me ka lehulehu maʻamau. -hanamīkini SMTareflow umuhiki ke hoʻokō pono i nā koi o ka hui BGA.

II.ʻOiai ʻo BGA encapsulation ka mea i loaʻa i luna, loaʻa iā ia nā pilikia aʻe.Eia nā hemahema o ka encapsulation BGA:
1. He paʻakikī ke nānā a mālama i ka BGA ma hope o ka wili.Pono nā mea hana PCB e hoʻohana i ka X-ray fluoroscopy a i ʻole X-ray layering inspection no ka hōʻoia ʻana i ka hilinaʻi o ka pilina o ka papa kaapuni, a he kiʻekiʻe nā kumukūʻai.
2. Ua haki nā hui solder pākahi o ka papa kaapuni, no laila pono e wehe ʻia ka ʻāpana holoʻokoʻa, a ʻaʻole hiki ke hoʻohana hou ʻia ka BGA i wehe ʻia.