ʻO kekahi mau pilikia maʻamau a me nā hoʻonā i ka soldering

Hoʻohuhū ma ka PCB substrate ma hope o ke kūʻai ʻana o SMA

ʻO ke kumu nui o ke ʻano o ka nui o nā kui ma hope o ka kuʻi ʻana o SMA, ʻo ia hoʻi ka wai i hoʻokomo ʻia i loko o ka PCB substrate, ʻoi aku hoʻi i ka hana ʻana o nā papa multilayer.No ka mea, ua hana ʻia ka papa multilayer me ka multi-layer epoxy resin prepreg a laila kaomi wela, inā pōkole ka manawa mālama o ka epoxy resin semi curing ʻāpana, ʻaʻole lawa ka resin, a ʻaʻole maʻemaʻe ka wehe ʻana o ka wai ma mua o ka hoʻomaloʻo ʻana. maʻalahi ka lawe ʻana i ka mahu wai ma hope o ke kaomi wela.No ka mea, ʻaʻole lawa ka maʻiʻo semi-solid ponoʻī, ʻaʻole lawa ka adhesion ma waena o nā papa a waiho i nā ʻōpala.Eia kekahi, ma hope o ke kūʻai ʻia ʻana o ka PCB, ma muli o ka lōʻihi o ka mālama ʻana a me ka mālama ʻana i ka wai, ʻaʻole i hoʻomoʻa mua ʻia ka chip i ka manawa ma mua o ka hana ʻana, a ʻo ka PCB i hoʻomaʻemaʻe ʻia hoʻi i ka blister.

Pane: Hiki ke waiho ʻia ka PCB i loko o kahi waihona ma hope o ka ʻae ʻana;Pono e kālua mua ʻia ka PCB ma (120 ± 5) ℃ no 4 mau hola ma mua o ka waiho ʻana.

Wehe kaapuni a i ʻole hoʻoheheʻe ʻia o ka pine IC ma hope o ke kūʻai ʻana

Nā kumu:

1) ʻAʻole maikaʻi ka coplanarity, ʻoi aku hoʻi no nā hāmeʻa fqfp, alakaʻi i ka deformation pin ma muli o ka mālama pono ʻole.Inā ʻaʻole i loaʻa i ka mauna ka hana o ka nānā ʻana i ka coplanarity, ʻaʻole maʻalahi ke ʻike.

2) ʻO ka maikaʻi ʻole o nā pine, ka manawa mālama lōʻihi o ka IC, ka melemele o nā pine a me ka maikaʻi ʻole o ka solderability nā kumu nui o ke kūʻai hewa ʻana.

3) ʻAʻole maikaʻi ka maikaʻi o ka paʻi paʻi, haʻahaʻa haʻahaʻa metala a maikaʻi ʻole ka solderability.ʻO ka paʻi solder i hoʻohana mau ʻia no ka wiliwili ʻana i nā mea hana fqfp e loaʻa i kahi mea metala ʻaʻole i emi iho ma mua o 90%.

4) Inā kiʻekiʻe loa ka mahana preheating, maʻalahi ke kumu i ka oxidation o nā pine IC a hoʻonui i ka solderability.

5) He liʻiliʻi ka nui o ka puka aniani paʻi, no laila ʻaʻole lawa ka nui o ka paʻi solder.

ʻōlelo hoʻoholo:

6) E hoʻolohe i ka waiho ʻana o ka mea hana, mai lawe i ka ʻāpana a wehe paha i ka pūʻolo.

7) I ka wā o ka hana ʻana, pono e nānā ʻia ka solderability o nā ʻāpana, ʻoi aku ka lōʻihi o ka manawa mālama IC (i loko o hoʻokahi makahiki mai ka lā o ka hana ʻana), ʻaʻole pono e hōʻike ʻia ka IC i ke kiʻekiʻe o ka mahana a me ka haʻahaʻa i ka wā mālama.

8) E nānā pono i ka nui o ka puka aniani, ʻaʻole pono e ʻoi aku ka nui a i ʻole ka liʻiliʻi, a e hoʻolohe pono i ka nui o ka PCB pad.