Hoʻonā paʻi paʻi paʻi no nā ʻāpana liʻiliʻi 3-2

No ka hoʻomaopopo ʻana i nā pilikia i lawe ʻia e nā mea liʻiliʻi i ka paʻi paʻi solder, pono mākou e hoʻomaopopo mua i ka ratio o ka paʻi stencil (Area Ratio).

No ka paʻi paʻi solder o nā pads liʻiliʻi, ʻoi aku ka liʻiliʻi o ka pad a me ka wehe ʻana o ka stencil, ʻoi aku ka paʻakikī o ka paʻi solder e hoʻokaʻawale mai ka paia puka stencil. no ka ʻike:

1. ʻO ka hopena pololei loa,ʻo ia ka ho'ēmiʻana i ka mānoanoa o ke kila kila a me ka hoʻonuiʻana i ka ratio o ka'āpana o nā puka.Inā ʻaʻohe ʻāpana nui o ka substrate i hana ʻia, a laila ʻo ia ka hopena maʻalahi a maikaʻi loa.Akā inā he nui nā ʻāpana ma luna o ka substrate, e kūʻai maikaʻi ʻia nā ʻāpana nui ma muli o ka liʻiliʻi o ka tin.No laila inā he substrate hui nui me nā mea nui, pono mākou i nā hopena ʻē aʻe i helu ʻia ma lalo nei.

1. E hoʻohana i ka ʻenehana mesh kila hou e hōʻemi i ke koi no ka lakio o nā wehe i ka stencil.

1) FG (Fine Grain) stencil kila

Loaʻa i ka pepa kila FG kahi ʻano mea niobium, hiki ke hoʻomaʻemaʻe i ka palaoa a hoʻemi i ka naʻau overheat a me ka huhū brittleness o ke kila, a hoʻomaikaʻi i ka ikaika.ʻOi aku ka maʻemaʻe a ʻoi aku ka maʻemaʻe o ka pā puka o ka pepa kila FG i ʻoki ʻia i ka laser ma mua o ka ʻāpana kila 304 maʻamau, ʻoi aku ka maikaʻi o ka demolding.Hiki ke emi ma lalo o 0.65 ka lākiō o ka wehe ʻana o ka mesh kila i hana ʻia me ka pepa kila FG.Hoʻohālikelike ʻia me ka 304 mesh mesh me ka ratio wehe like, hiki ke hana ʻia ka mīkini kila FG i ʻoi aku ka mānoanoa ma mua o ka 304 mesh mesh, a laila e hōʻemi i ka pilikia o ka liʻiliʻi liʻiliʻi no nā mea nui.