ʻElima mau ʻenehana maʻamau i hoʻohana ʻia i ka hana ʻana o ka papa kaapuni paʻi.
1. Mīkini: Hoʻopili kēia i ka hoʻoheheʻe ʻana, ke kuʻi ʻana a me ke ala ʻana i nā lua ma ka papa kaapuni i paʻi ʻia me ka hoʻohana ʻana i nā mīkini maʻamau, a me nā ʻenehana hou e like me ka laser a me ka ʻoki wai.Pono e noʻonoʻo ʻia ka ikaika o ka papa i ka wā e hana ai i nā aperture pololei.ʻO nā puka liʻiliʻi ke kumu kūʻai a emi ʻole ka hilinaʻi ʻana o kēia ʻano hana ma muli o ka hōʻemi ʻana o ke ʻano lākiō, ʻo ia hoʻi ka paʻakikī o ka plating.
2. Kiʻi: Hoʻololi kēia ʻanuʻu i ka hana kiʻi kaapuni i nā papa pākahi.Hiki ke paʻi ʻia nā papa kaapuni paʻi ʻaoʻao hoʻokahi a i ʻole ʻaoʻao ʻelua me ka hoʻohana ʻana i nā ʻenehana paʻi pale maʻalahi, e hana ana i kahi ʻano paʻi a etch.Akā, he palena iki ka laulā laina i hiki ke hoʻokō.No nā papa kaapuni maikaʻi a me nā multilayers, hoʻohana ʻia nā ʻenehana kiʻi optical no ka paʻi ʻana i ka pale wai, ka uhi ʻana, electrophoresis, roller lamination, a i ʻole ka uhi ʻili wai.I nā makahiki i hala iho nei, ua hoʻohana nui ʻia ka ʻenehana kiʻi kiʻi laser a me ka ʻenehana kiʻi kiʻi wai aniani.3.
3. lamination: Hoʻohana nui ʻia kēia kaʻina hana no ka hana ʻana i nā papa multilayer, a i ʻole substrates no nā panela hoʻokahi / pālua.Hoʻopili pū ʻia nā ʻāpana o nā panela aniani i hoʻopili ʻia me ka resin epoxy b-grade me kahi kaomi hydraulic e hoʻopaʻa pū ai i nā papa.ʻO ke ʻano paʻi hiki ke paʻi anu, paʻi wela, ka ipu hao i kōkua ʻia, a i ʻole ka ipu hao, e hāʻawi ana i ka mana paʻa ma luna o ka media a me ka mānoanoa.4.
4. Plating: ʻO ke kaʻina hana metallization hiki ke hoʻokō ʻia e nā kaʻina hana kemika pulu e like me ke kinikini a me ka electrolytic plating, a i ʻole ma nā kaʻina hana kemika maloʻo e like me ka sputtering a me CVD.ʻOiai ʻo ka plating kemika e hāʻawi i nā lakene kiʻekiʻe a ʻaʻohe o waho o waho, no laila e hoʻokumu i ke kumu o ka ʻenehana additive, ʻo ka electrolytic plating ke ala i makemake ʻia no ka metallization bulk.ʻO nā hana hou e like me nā kaʻina hana electroplating e hāʻawi i ka ʻoi aku ka maikaʻi a me ka maikaʻi ʻoiai e hōʻemi ana i ka ʻauhau kaiapuni.
5. Etching: Ke kaʻina hana no ka wehe ʻana i nā metala makemake ʻole a me nā dielectrics mai kahi papa kaapuni, maloʻo a pulu paha.ʻO ka like ʻole o ka etching ka mea e hopohopo nui ai i kēia pae, a ke kūkulu ʻia nei nā hopena etching anisotropic hou e hoʻonui i ka hiki o ka etching line fine.
Nā hiʻohiʻona o NeoDen ND2 Automatic Stencil Printer
1. Pūnaehana hoʻonohonoho ʻike pono
Hiki ke hoʻololi ʻia ke kumu kukui ʻehā, hiki ke hoʻololi ʻia ka ikaika o ka māmā, ʻano like ke kukui, a ʻoi aku ka maikaʻi o ka loaʻa ʻana o nā kiʻi.
ʻO ka ʻike maikaʻi (me nā helu ʻole like ʻole), kūpono no ka tinning, keleawe plating, Gold plating, tin spraying, FPC a me nā ʻano PCB me nā kala like ʻole.
2. Pūnaehana squeegee akamai
ʻO ka hoʻonohonoho polokalamu naʻauao, ʻelua mau kaʻa kūʻokoʻa kūʻokoʻa i hoʻokele ʻia i ka squeegee, kūkulu ʻia i loko o ka ʻōnaehana kaomi pololei.
3. High pono a me kiʻekiʻe adaptability stencil hoʻomaʻemaʻe nenoaiu
ʻO ka ʻōnaehana holoi holoi hou e hōʻoia i ka pili piha me ka stencil.
Hiki ke koho ʻia ʻekolu mau ʻano hoʻomaʻemaʻe o ka maloʻo, pulu a me ka hoʻohuihui manuahi;ʻO ka pāpaʻi holoi ʻaʻahu palupalu, hoʻomaʻemaʻe maikaʻi, wehe ʻia, a me ka lōʻihi o ka pepa holoi.
4. 2D solder paste ka nānā ʻana i ka maikaʻi o ka paʻi ʻana a me ka nānā ʻana o SPC
Hiki i ka hana 2D ke ʻike koke i nā hemahema paʻi e like me ka offset, ka liʻiliʻi o ka tin, ka nalo ʻana o ka paʻi ʻana a me ka hoʻohui ʻana i ka tin, a hiki ke hoʻonui ʻia nā wahi ʻike.
Hiki i ka polokalamu SPC ke hōʻoia i ka maikaʻi o ka paʻi ʻana ma o ka mīkini hōʻike hōʻike CPK index i hōʻiliʻili ʻia e ka mīkini.
Ka manawa hoʻouna: Feb-10-2023