Hoʻokaʻawale ʻia ʻana o nā mea ʻala o ka papa PCB

Nui nā ʻano ʻano substrate i hoʻohana ʻia no nā PCB, akā māhele ākea i ʻelua mau ʻāpana, ʻo ia hoʻi nā mea substrate inorganic a me nā mea substrate organik.

ʻO nā mea substrate inorganic

ʻO ka substrate inorganic ka nui o nā papa seramika, ʻo 96% alumina ka mea hoʻoheheʻe kaapuni seramika, inā makemake ʻia kahi substrate ikaika kiʻekiʻe, hiki ke hoʻohana ʻia ka 99% alumina maʻemaʻe akā hiki ke hoʻohana ʻia ka alumina maʻemaʻe kiʻekiʻe, ka haʻahaʻa o ka hua, no laila ka kiʻekiʻe ka hoʻohana ʻana i ke kumu kūʻai alumina maʻemaʻe.ʻO Beryllium oxide ka mea waiwai o ka substrate seramika, he metala oxide, loaʻa nā waiwai insulation uila maikaʻi a me ka conductivity thermal maikaʻi loa, hiki ke hoʻohana ʻia ma ke ʻano he substrate no nā kaʻa kaʻa kiʻekiʻe.

Hoʻohana nui ʻia nā substrate kaapuni seramika i loko o nā ʻāpana ʻoniʻoni ʻoniʻoni ʻoniʻoni mānoanoa a lahilahi, nā ʻāpana micro-assembly multi-chip, i loaʻa nā mea maikaʻi ʻaʻole hiki ke hoʻohālikelike ʻia nā substrates kaapuni kūlohelohe.No ka laʻana, hiki i ka CTE o ka ʻāpana kaapuni ceramic ke hoʻohālikelike i ka CTE o ka hale LCCC, no laila e loaʻa ai ka hilinaʻi hui pū ʻana maikaʻi i ka wā e hui pū ai i nā mea LCCC.Eia kekahi, kūpono nā substrates seramika no ke kaʻina hana hoʻoheheʻe ʻana i ka hana chip no ka mea ʻaʻole lākou e hoʻokuʻu i ka nui o nā kinoea adsorbed e hoʻohaʻahaʻa i ke kiʻekiʻe o ka vacuum ʻoiai ke wela.Eia hou, he kiʻekiʻe ka pale wela o nā substrate seramika, ka hoʻopau ʻana i ka ʻili maikaʻi, ke kūpaʻa kemika kiʻekiʻe, ʻo ia ka substrate kaapuni i makemake ʻia no nā kaapuni hybrid kiʻiʻoniʻoni mānoanoa a me nā ʻāpana micro-assembly multi-chip.Eia nō naʻe, paʻakikī ke hana i kahi substrate nui a palahalaha, a ʻaʻole hiki ke hana ʻia i loko o kahi papa peʻa i hui pū ʻia e hoʻokō i nā pono o ka hana automated. ʻAʻole kūpono hoʻi no nā substrates kaapuni kiʻekiʻe, a he kiʻekiʻe ke kumukūʻai.

ʻO nā mea substrate organik

Hana ʻia nā mea substrate organik me nā mea hoʻoikaika e like me ka lole fiber glass (pepa fiber, ka moena aniani, a me nā mea ʻē aʻe), i hoʻopili ʻia me ka resin binder, maloʻo i loko o kahi hakahaka, a laila uhi ʻia me ke keleawe keleawe, a hana ʻia e ka wela kiʻekiʻe a me ke kaomi.Kapa ʻia kēia ʻano substrate he copper-clad laminate (CCL), i ʻike maʻamau ʻia ʻo nā paneli keleawe, ʻo ia ka mea nui no ka hana ʻana i nā PCB.

ʻO ka CCL nā ʻano like ʻole, inā ʻo ka mea hoʻoikaika i hoʻohana ʻia e puʻunaue, hiki ke hoʻokaʻawale ʻia i loko o ka pepa, ka lole aniani fiber, composite base (CEM) a me ka metala ʻehā mau ʻāpana;e like me ka organic resin binder i hoʻohana 'ia e puunaue, a hiki ke maheleia i phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) a me polyphenylene etera resin (PPO);inā paʻa ka substrate a hiki ke hoʻokaʻawale ʻia, a hiki ke hoʻokaʻawale ʻia i CCL paʻa a me CCL maʻalahi.

I kēia manawa hoʻohana nui ʻia i ka hana ʻana o ka PCB ʻaoʻao ʻelua he epoxy aniani fiber circuit substrate, kahi e hui pū ai i nā pono o ka ikaika maikaʻi o ke aniani fiber a me ka epoxy resin toughness, me ka ikaika a me ka ductility.

Hana ʻia ka epoxy aniani fiber circuit substrate e ka hoʻokomo mua ʻana i ka resin epoxy i loko o ka lole fiber aniani e hana i ka laminate.I ka manawa like, hoʻohui ʻia nā mea kemika ʻē aʻe, e like me ka curing agents, stabilizers, anti-flammability agents, adhesives, etc. laminate.Hiki ke hoʻohana ʻia e hana i nā PCB ʻaoʻao hoʻokahi, ʻelua ʻaoʻao a me multilayer.