Hoʻomaka i ka PCB substrate

Ka hoʻokaʻawale ʻana o nā substrates

Hiki ke hoʻokaʻawale ʻia nā mea paʻi papa paʻi maʻamau i ʻelua ʻāpana: nā mea substrate paʻa a me nā mea substrate maʻalahi.ʻO kahi ʻano koʻikoʻi o ka mea paʻa paʻa paʻa maʻamau he laminate ʻaʻahu keleawe.Hana ʻia ʻo Reinforeing Material, i hoʻopili ʻia me ka resin binder, hoʻomaloʻo, ʻokiʻoki a laminated i ka blank, a laila uhi ʻia me ka foil keleawe, me ka hoʻohana ʻana i ke kila kila e like me ka mold, a hana ʻia e ke kiʻekiʻe kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe i kahi kaomi wela.ʻO ka pepa semi-cured multilayer maʻamau, ua ʻaʻahu ʻia ke keleawe i ke kaʻina hana o nā huahana semi-hoʻopau (ʻo ka hapa nui o nā lole aniani i hoʻomoʻi ʻia i ka resin, ma o ka hoʻomaloʻo ʻana).

Aia nā ʻano hoʻohālikelike like ʻole no ka laminate copper clad.ʻO ka mea maʻamau, e like me nā mea hoʻoikaika ʻokoʻa o ka papa, hiki ke hoʻokaʻawale ʻia i ʻelima mau ʻāpana: ka waihona pepa, ke kumu o ke aniani fiber, ka base composite (CEM series), laminated multilayer board base a me nā kumu waiwai kūikawā (ceramics, metal core base, etc.).Inā hoʻohana ʻia ka papa e nā mea hoʻopili resin ʻokoʻa no ka hoʻohālikelike ʻana, ʻo ka pepa maʻamau - e pili ana i ka CCI.Aia kekahi: resin phenolic (XPc, XxxPC, FR 1, FR 2, etc.), resin epoxy (FE 3), resin polyester a me nā ʻano ʻē aʻe.ʻO ka CCL maʻamau ka epoxy resin (FR-4, FR-5), ʻo ia ke ʻano nui o ka lole fiber aniani.Eia kekahi, aia kekahi mau resins kūikawā (ka lole aniani fiber, polyamide fiber, non-woven cloth, etc., e like me nā mea i hoʻohui ʻia): bismaleimide modified trizine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), maleic anhydride imide - styrene resin (MS), polycyanate ester resin, polyolefin resin, etc.

E like me ka hana hoʻopaʻa ahi o CCL, hiki ke hoʻokaʻawale ʻia i ke ʻano o ka lapalapa ahi (UL94-VO, UL94-V1) a me ke ʻano o ke ahi ahi ʻole (Ul94-HB).I nā makahiki he 12 i hala iho nei, ua hoʻokaʻawale ʻia kahi ʻano hou o ka flame-retardant CCL me ka bromine ʻole, hiki ke kapa ʻia ʻo "green flame-retardant CCL".Me ka hoʻomohala wikiwiki o ka ʻenehana huahana uila, loaʻa i ka cCL nā koi hana kiʻekiʻe.No laila, mai ka CCL hana hoʻohālikelike, a māhele ʻia i ka hana maʻamau CCL, haʻahaʻa dielectric mau CCL, kiʻekiʻe wela ka pale ʻana CCL (general plate L i 150 ℃ ma luna), haʻahaʻa thermal expansion coefficient CCL (hoʻohana mau ʻia ma ka substrate packaging) a me nā ʻano ʻē aʻe. .

Kūlana o ka hoʻokō substrate

Me ka hoʻomohala ʻana a me ka holomua mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa i paʻi ʻia, i mea e hoʻoikaika ai i ka hoʻomohala mau ʻana o nā kūlana paʻa keleawe.I kēia manawa, ʻo nā kūlana nui no nā mea substrate e like me kēia.
1) National Standards for Substrates I kēia manawa, ʻO nā kūlana aupuni no nā substrates ma Kina e komo pū me GB / T4721 — 4722 1992 a me GB 4723 — 4725 — 1992. ʻO ka maʻamau no nā laminates ʻaʻahu keleawe ma Taiwan ʻāina o Kina ka maʻamau CNS, kahi i hoʻokumu ʻia. ma ke kūlana JI Iapana a ua hoʻopuka ʻia i ka makahiki 1983.

Me ka hoʻomohala ʻana a me ka holomua mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa i paʻi ʻia, i mea e hoʻoikaika ai i ka hoʻomohala mau ʻana o nā kūlana paʻa keleawe.I kēia manawa, ʻo nā kūlana nui no nā mea substrate e like me kēia.
1) Nā Kūlana Lahui no nā Substrates I kēia manawa, ʻo GB/T4721 — 4722 1992 a me GB 4723 — 4725 — 1992 nā kūlana aupuni o Kina no nā substrates. ʻO ke kūlana JI Iapana a ua hoʻopuka ʻia i ka makahiki 1983.
2) ʻO nā kūlana aupuni ʻē aʻe e pili ana i ke kūlana Japanese JIS, American ASTM, NEMA, MIL, IPc, ANSI a me UL standard, British Bs standard, German DIN a me VDE standard, French NFC a me UTE standard, Canadian CSA standard, Australian AS standard, FOCT standard o ka Soviet Union mua, a me ke kūlana IEC honua

Kuhi ʻia ka maʻamau hōʻuluʻulu inoa maʻamau ma ke ʻano he keʻena o ka hoʻokumu ʻana i ka inoa maʻamau
JIS- Ke Kūlana Hana Hana Iapana - Hui Hoʻohālikelike Iapana
ASTM- American Society for Laboratory Materials Standards -American Society for Testi 'ng and Materials
NEMA- National Association of Electrical Manufactures Standard -Nafiomll Electrical Manufactures
MH- Nā Kūlana Koa Koa o ʻAmelika Hui Pū ʻIa - Keʻena o ka Puʻuwai Koa Kūikawā Kūikawā a me nā Kūlana
IPC- American Circuit Interconnection and Packaging Association Standard -ʻO ka pule ʻoiaʻiʻo no Interoonnecting and Packing EIectronics Circuits
ANSl- American National Standard Institute