1. BGA
Hōʻike pāʻani kinipōpō, kekahi o nā pūʻolo ʻano mauna ʻili.Hana ʻia nā puʻupuʻu kinipōpō ma ke kua o ka substrate i paʻi ʻia e pani i nā pine e like me ke ʻano hōʻike, a ua ʻākoakoa ka chip LSI ma ke alo o ka substrate i paʻi ʻia a hoʻopaʻa ʻia me ka resin molded a i ʻole ke ʻano potting.Ua kapa ʻia kēia ʻo ka bump display carrier (PAC).Hiki i nā pine ke ʻoi aku ma mua o 200 a he ʻano pūʻolo i hoʻohana ʻia no nā LSI multi-pin.Hiki ke hana liʻiliʻi ʻia ke kino pūʻolo ma mua o ka QFP (ʻaoʻao ʻaoʻao ʻaoʻao paʻa paʻa).No ka laʻana, he 360-pin BGA me 1.5mm pin centers he 31mm square wale nō, aʻo ka 304-pin QFP me 0.5mm pin centers he 40mm square.A ʻaʻole hopohopo ka BGA e pili ana i ka deformation pin e like me ka QFP.Ua hoʻomohala ʻia ka pūʻolo e Motorola ma ʻAmelika Hui Pū ʻIa a ua lawe mua ʻia i nā polokalamu e like me nā kelepona paʻa, a e lilo paha i mea kaulana ma ʻAmelika no nā kamepiula pilikino i ka wā e hiki mai ana.I ka hoʻomaka ʻana, ʻo 1.5mm ka mamao waena o ka pine (bump) o BGA a ʻo ka helu o nā pine he 225. Ke kūkulu ʻia nei ka 500-pin BGA e kekahi mau mea hana LSI.ʻO ka pilikia o BGA ka nānā ʻana ma hope o ka reflow.
2. BQFP
ʻO kahi pūʻolo paʻa ʻehā me ka bumper, kekahi o nā pūʻolo QFP, he mau puʻupuʻu (bumper) ma nā kihi ʻehā o ke kino puʻupuʻu e pale ai i ka piʻo ʻana o nā pine i ka wā o ka hoʻouna ʻana.Hoʻohana nui nā mea hana semiconductor US i kēia pūʻolo i nā kaapuni e like me nā microprocessors a me ASIC.0.635mm ka nui o nā pine mai 84 a 196 a pēlā paha.
3. Kūʻai kūʻai PGA (pūnaewele hoʻopaʻa pine hui pū) Alias o ka mauna ʻili PGA.
4. C-(keramika)
ʻO ka hōʻailona o ka pūʻolo seramika.No ka laʻana, ʻo CDIP ke ʻano o ka ceramic DIP, i hoʻohana pinepine ʻia i ka hana.
5. Cerdip
ʻO ka pūʻolo laina lua Ceramic i hoʻopaʻa ʻia me ke aniani, i hoʻohana ʻia no ka ECL RAM, DSP (Digital Signal Processor) a me nā kaapuni ʻē aʻe.Hoʻohana ʻia ʻo Cerdip me ka puka aniani no ka UV erasure type EPROM a me nā microcomputer circuit me EPROM i loko.ʻO 2.54mm ka mamao waena o ka pine a ʻo ka helu o nā pine mai 8 a 42.
6. Cerquad
Hoʻohana ʻia kekahi o nā puʻupuʻu mauna ʻili, ʻo ka QFP ceramic me ka underseal, e hoʻopaʻa i nā loina LSI e like me DSP.Hoʻohana ʻia ʻo Cerquad me kahi puka makani e hoʻopili i nā kaapuni EPROM.ʻOi aku ka maikaʻi o ka hoʻoheheʻe ʻana i ka wela ma mua o nā QFP plastik, e ʻae ana i ka 1.5 a i ka 2W o ka mana ma lalo o nā kūlana hoʻoluʻu kūlohelohe.Eia nō naʻe, ʻo ke kumukūʻai o ka pōʻai he 3 a 5 mau manawa kiʻekiʻe ma mua o nā QFP plastik.ʻO 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, a pēlā aku ka nui o nā pine mai 32 a 368.
7. CCC
ʻO ka mea lawe puʻupuʻu alakaʻi seramika me nā pine, kekahi o ka puʻupuʻu mauna ʻili, alakaʻi ʻia nā pine mai nā ʻaoʻao ʻehā o ka pūʻolo, ma ke ʻano he ding.Me ka puka makani no ka pūʻolo o UV holoi ʻia ʻano EPROM a me ka microcomputer circuit me EPROM, etc.. Ua kapa ʻia kēia pūʻolo QFJ, QFJ-G.
8. COB (pili ma ka moku)
ʻO ka puʻupuʻu ma luna o ka papa ʻo ia kekahi o ka ʻenehana hoʻokomo ʻana i ka chip, ua kau ʻia ka chip semiconductor ma ka papa kaapuni i paʻi ʻia, ʻike ʻia ka pilina uila ma waena o ka chip a me ka substrate ma ke ʻano stitching alakaʻi, ʻike ʻia ka pilina uila ma waena o ka chip a me ka substrate e ke ala humuhumu alakaʻi. , a ua uhi ʻia me ka resin e hōʻoia i ka hilinaʻi.ʻOiai ʻo COB ka ʻenehana hoʻokomo ʻana i nā puʻupuʻu maʻalahi, akā ʻoi aku ka haʻahaʻa o kāna puʻupuʻu i ka TAB a me ka ʻenehana hoʻoheheʻe chip inverted.
9. DFP (pāpā pālua pālua)
pūʻolo palahalaha ʻaoʻao ʻelua.ʻO ia ka inoa o SOP.
10. DIC (lua in-line ceramic package)
LIKE LIKE LIKE LIKE
11. DIL(ʻelua ma ka laina)
DIP alias (e nana DIP).Hoʻohana nui nā mea hana semiconductor ʻEulopa i kēia inoa.
12. DIP(ʻelua pūʻolo laina)
pūʻolo laina ʻelua.ʻO kekahi o ka pahu pahu pahu, alakaʻi ʻia nā pine mai nā ʻaoʻao ʻelua o ka pūʻolo, ʻelua ʻano o ka plastic a me ka ceramic ka mea paʻi.ʻO DIP ka pahu pahu pahu kaulana loa, nā noi e komo pū me ka IC logic maʻamau, LSI hoʻomanaʻo, microcomputer circuits, a me nā mea ʻē aʻe.ʻO kekahi mau pūʻolo me ka laula o 7.52mm a me 10.16mm ua kapa ʻia ʻo DIP ʻili a me ka DIP slim.Eia hou, ua kapa ʻia nā DIP ceramic i hoʻopaʻa ʻia me ke aniani hoʻoheheʻe haʻahaʻa he cerdip (e ʻike i ka cerdip).
13. DSO (lua liʻiliʻi liʻiliʻi liʻiliʻi)
He inoa inoa no SOP (e nānā i ka SOP).Hoʻohana kekahi mau mea hana semiconductor i kēia inoa.
14. DICP (puke lawe lipine pālua)
ʻO kekahi o ka TCP (pēke lawe lipine).Hana ʻia nā pine ma kahi lipine insulating a alakaʻi i waho mai nā ʻaoʻao ʻelua o ka pūʻolo.Ma muli o ka hoʻohana ʻana i ka ʻenehana TAB (hoʻopaʻa paʻa kiʻi ʻoniʻoni ʻoniʻoni), ʻeleʻele loa ka ʻaoʻao o ka pōʻai.Hoʻohana maʻamau ia no nā LSI mea hoʻokele LCD, akā ʻo ka hapa nui o lākou i hana maʻamau.Eia kekahi, ke kūkulu ʻia nei kahi pūʻolo puke LSI memo 0.5mm mānoanoa.I Iapana, kapa ʻia ka DICP ʻo DTP e like me ka EIAJ (Electronic Industries and Machinery of Japan).
15. DIP
E like me ka luna.ʻO ka inoa o DTCP ma ke kūlana EIAJ.
16. FP(pūʻolo palahalaha)
Puke palahalaha.He inoa inoa no QFP a i ʻole SOP (e nānā i ka QFP a me ka SOP).Hoʻohana kekahi mau mea hana semiconductor i kēia inoa.
17. ʻoki-pili
ʻOpe-pili.ʻO kekahi o nā ʻenehana pahu pahu pahu pahu kahi i hana ʻia ai kahi puʻupuʻu metala ma ka wahi electrode o ka chip LSI a laila hoʻopaʻa ʻia ka puʻupuʻu metala i ka wahi electrode ma ka substrate i paʻi ʻia.ʻO ka ʻāpana i noho ʻia e ka pūʻolo e like me ka nui o ka chip.ʻO ia ka ʻenehana liʻiliʻi a ʻoi loa o nā ʻenehana paʻi.Eia nō naʻe, inā ʻokoʻa ka coefficient o ka hoʻonui wela o ka substrate mai ka LSI chip, hiki iā ia ke hana i ka hui a pēlā e hoʻopili ai i ka hilinaʻi o ka pilina.No laila, pono e hoʻoikaika i ka chip LSI me ka resin a hoʻohana i kahi mea substrate me ka like o ka coefficient o ka hoʻonui wela.
18. FQFP
QFP me ka mamao kikowaena pine liʻiliʻi, ʻoi aku ka liʻiliʻi ma mua o 0.65mm (e ʻike i ka QFP).Hoʻohana kekahi mau mea hana conductor i kēia inoa.
19. CPAC
ʻO ka inoa inoa o Motorola no BGA.
20. CQFP (pūʻolo fiat quad me ke apo kiaʻi)
Puke Quad fiat me ke apo kiaʻi.ʻO kekahi o nā QFP plastik, ua uhi ʻia nā pine me kahi apo resin pale e pale aku ai i ke kulou a me ka deformation.Ma mua o ka hui ʻana i ka LSI ma ka substrate i paʻi ʻia, ua ʻoki ʻia nā pine mai ke apo kiaʻi a hana ʻia i ʻēheu seagull (L-shape).Aia kēia pūʻolo i ka hana nui ma Motorola, USA.ʻO 0.5mm ka mamao o ke kikowaena, a ʻo ka nui o nā pine he 208.
21. H-(me ka wela wela)
Hōʻike i kahi hōʻailona me ka wela wela.No ka laʻana, hōʻike ʻo HSOP iā SOP me ka wela.
22. Pin grid array (ʻano mauna i luna)
ʻO ka PGA mauna mauna ʻano maʻamau he pūʻolo ʻano pahu pahu me ka lōʻihi o ka pine ma kahi o 3.4mm, a ʻo ke ʻano mauna ʻili PGA he hōʻike i nā pine ma ka ʻaoʻao lalo o ka pūʻolo me ka lōʻihi mai 1.5mm a 2.0mm.No ka mea ʻo 1.27mm wale nō ka mamao o ke kikowaena pine, ʻo ia ka hapalua o ka nui o ka pahu pahu PGA, hiki ke hoʻemi ʻia ke kino o ka pahu, a ʻoi aku ka nui o nā pine ma mua o ke ʻano o ka pahu pahu (250-528), no laila. ʻo ia ka pūʻolo i hoʻohana ʻia no ka LSI loiloi nui.ʻO nā pāpaʻi pūʻolo he mau ʻāpana seramika multilayer a me nā substrate paʻi epoxy resin aniani.ʻO ka hana ʻana o nā pūʻolo me nā substrate seramika multilayer ua lilo i mea kūpono.
23. JLCC (J-leaded chip carrier)
J-like pin chip lawe lima.E pili ana i ka puka aniani CLCC a me ka puka aniani QFJ alias (e nana CLCC a me QFJ).Hoʻohana kekahi o nā mea hana semi-conductor i ka inoa.
24. LCC (Ka mea lawe pahu alakaʻi ʻole)
Mea lawe puʻupuʻu pinless.E pili ana ia i ka puʻupuʻu mauna ili kahi i hoʻopili ʻia nā electrodes ma nā ʻaoʻao ʻehā o ka substrate seramika me ka ʻole o nā pine.Kiʻekiʻe-wikiwiki a kiʻekiʻe-frequency pūʻolo IC, i kapa ʻia he ceramic QFN a i ʻole QFN-C.
25. LGA (land grid array)
Hoʻokaʻaʻike pūʻolo hōʻike.He pūʻolo i loaʻa i nā mea hoʻopili ma ka ʻaoʻao lalo.I ka hui ʻana, hiki ke hoʻokomo ʻia i loko o ke kumu.He 227 mau mea hoʻopili (1.27mm mamao waena) a me 447 mau mea hoʻopili (2.54mm waena waena) o nā LGA seramika, i hoʻohana ʻia i nā kaʻapuni LSI logic kiʻekiʻe.Hiki i nā LGA ke hoʻokomo i nā pine hoʻokomo a me nā mea hoʻopuka i loko o kahi pūʻolo liʻiliʻi ma mua o nā QFP.Eia kekahi, ma muli o ka haʻahaʻa haʻahaʻa o nā alakaʻi, kūpono ia no ka LSI kiʻekiʻe.Eia naʻe, ma muli o ka paʻakikī a me ke kumukūʻai kiʻekiʻe o ka hana ʻana i nā kumu, ʻaʻole i hoʻohana nui ʻia i kēia manawa.Ke manaʻo ʻia nei ka piʻi ʻana o ka noi no lākou i ka wā e hiki mai ana.
26. LOC (ke alakaʻi ma ka chip)
ʻO ka ʻenehana hoʻopihapiha LSI kahi ʻano i hana ʻia ai ka ʻaoʻao mua o ke kumu alakaʻi ma luna o ka chip a ua hana ʻia kahi hui solder puʻupuʻu kokoke i ke kikowaena o ka chip, a hana ʻia ka pilina uila ma ke humuhumu ʻana i nā alakaʻi.Ke hoʻohālikelike ʻia me ka hale mua kahi i waiho ʻia ai ke kumu alakaʻi ma kahi kokoke i ka ʻaoʻao o ka chip, hiki ke hoʻokomo ʻia ka chip i loko o ka pūʻolo nui like me ka laulā o kahi o 1mm.
27. LQFP
E pili ana ka Thin QFP i nā QFP me ka mānoanoa o ke kino o 1.4mm, a ʻo ia ka inoa i hoʻohana ʻia e ka Japan Electronics Machinery Industry Association e like me nā kikoʻī kumu kumu QFP hou.
28. L-QUAD
ʻO kekahi o nā QFP seramika.Hoʻohana ʻia ka nitride alumini no ka substrate pōʻai, a ʻo ka conductivity thermal o ke kumu he 7 a 8 mau manawa kiʻekiʻe ma mua o ka alumini oxide, e hāʻawi ana i ka hoʻopau wela.Hana ʻia ke ʻano o ka pūʻolo me ka alumini oxide, a ua hoʻopaʻa ʻia ka chip e ke ʻano potting, no laila ke kāohi nei i ke kumukūʻai.He pūʻolo i hoʻomohala ʻia no ka logic LSI a hiki ke hoʻokomo i ka mana W3 ma lalo o nā kūlana hoʻoluʻu kūlohelohe.Ua kūkulu ʻia nā pūʻolo 208-pin (0.5mm center pitch) a me 160-pin (0.65mm center pitch) no LSI logic a ua hoʻokomo ʻia i loko o ka hana nui ma ʻOkakopa 1993.
29. MCM
Module puʻupuʻu nui.He pūʻolo kahi i hui ʻia ai nā ʻāpana semiconductor lehulehu ma luna o kahi substrate uwea.Wahi a ka mea substrate, hiki ke hoʻokaʻawale ʻia i ʻekolu mau ʻāpana, MCM-L, MCM-C a me MCM-D.ʻO MCM-L kahi hui e hoʻohana ana i ke aniani epoxy resin multilayer i paʻi ʻia.ʻOi aku ka liʻiliʻi a emi ke kumu kūʻai.He ʻāpana ʻo MCM-C e hoʻohana ana i ka ʻenehana kiʻiʻoniʻoni mānoanoa e hana i nā uwila multilayer me ka ceramic (alumina a i ʻole aniani-ceramic) ma ke ʻano he substrate, e like me nā IC hybrid film mānoanoa me ka hoʻohana ʻana i nā substrates ceramic multilayer.ʻAʻohe ʻokoʻa nui ma waena o nā mea ʻelua.ʻOi aku ke kiʻekiʻe o ka uwila ma mua o ka MCM-L.
He ʻāpana ʻo MCM-D e hoʻohana i ka ʻenehana kiʻiʻoniʻoni lahilahi e hana i nā uwila multilayer me ka ceramic (alumina a i ʻole alumini nitride) a i ʻole Si a me Al ma ke ʻano he substrates.ʻO ke kiʻekiʻe kiʻekiʻe o ka nui o ka uwila ma waena o nā ʻano ʻekolu, akā ʻoi aku ka kiʻekiʻe o ke kumukūʻai.
30. MFP (puʻi pālahalaha liʻiliʻi)
Puke palahalaha liʻiliʻi.He inoa inoa no ka SOP plastik a i ʻole SSOP (e ʻike iā SOP a me SSOP).ʻO ka inoa i hoʻohana ʻia e kekahi mau mea hana semiconductor.
31. MQFP
ʻO kahi hoʻohālikelike o nā QFP e like me ka JEDEC (Joint Electronic Devices Committee).E pili ana ia i ka QFP maʻamau me kahi mamao kikowaena pine o 0.65mm a me ka mānoanoa kino o 3.8mm a 2.0mm (e nānā i ka QFP).
32. MQUAD(metala quad)
He pūʻolo QFP i hoʻomohala ʻia e Olin, USA.ʻO ka papa kumu a me ka uhi i hana ʻia me ka alumini a hoʻopaʻa ʻia me ka hoʻopili.Hiki iā ia ke ʻae i ka 2.5W ~ 2.8W o ka mana ma lalo o ke kūlana hoʻoluʻu kūlohelohe.Ua laikini ʻia ʻo Nippon Shinko Kogyo e hoʻomaka i ka hana ma 1993.
33. MSP (pūʻolo huinaha liʻiliʻi)
ʻO QFI alias (e nānā i ka QFI), i ka wā mua o ka hoʻomohala ʻana, i kapa ʻia ʻo MSP, ʻo QFI ka inoa i kuhikuhi ʻia e ka Japan Electronics Machinery Industry Association.
34. OPMAC
ʻO ka mea lawe hōʻike hōʻike i ka resin sealing bump.ʻO ka inoa i hoʻohana ʻia e Motorola no ka hoʻoheheʻe ʻana i ka resine sila BGA (e nānā i ka BGA).
35. P-(palapala)
Hōʻike i ka notation o ka plastic package.No ka laʻana, ʻo PDIP ʻo ia ka DIP plastik.
36. PAC
ʻO ka mea lawe pahu hōʻikeʻike, alias o BGA (e nānā i ka BGA).
37. PCLP
Paʻi ʻia ka ʻāpana alakaʻi ʻole o ka papa kaapuni.ʻElua mau kikoʻī kikoʻī: 0.55mm a me 0.4mm.I kēia manawa i ka pae hoʻomohala.
38. PFPF
Puke palahalaha plastik.ʻO nā inoa inoa no ka plastic QFP (e nānā i ka QFP).Hoʻohana kekahi mau mea hana LSI i ka inoa.
39. PGA
Pūʻolo hui pū.ʻO kekahi o nā pūʻolo ʻano pahu pahu kahi i hoʻonohonoho ʻia ai nā pine kūpaʻa ma ka ʻaoʻao lalo ma ke ʻano hōʻike.ʻO ke kumu, hoʻohana ʻia nā substrate seramika multilayer no ka substrate package.I nā hihia kahi i hōʻike ʻole ʻia ai ka inoa mea, ʻo ka hapa nui he mau PGA seramika, i hoʻohana ʻia no nā kaʻapuni LSI logic kiʻekiʻe.He kiʻekiʻe ke kumukūʻai.ʻO nā kikowaena pine he 2.54mm ke kaʻawale a me nā helu pine mai 64 a ma kahi o 447. No ka hoʻemi ʻana i ke kumukūʻai, hiki ke hoʻololi ʻia ka substrate pōʻai e kahi substrate paʻi epoxy aniani.Loaʻa pū kekahi PG A me 64 a 256 mau pine.Aia kekahi ʻano puʻu pine pōkole ʻano PGA (touch-solder PGA) me kahi mamao kikowaena pine o 1.27mm.(E nānā i ke ʻano PGA mauna ʻili.
40. Pua hope
pūʻolo pūʻolo.ʻO kahi pūʻolo seramika me kahi kumu, like ke ʻano me kahi DIP, QFP, a i ʻole QFN.Hoʻohana ʻia i ka hoʻomohala ʻana i nā polokalamu me nā microcomputers e loiloi i nā hana hōʻoia papahana.No ka laʻana, ua hoʻokomo ʻia ka EPROM i loko o ke kumu no ka debugging.He huahana maʻamau kēia pūʻolo a ʻaʻole i loaʻa nui ʻia ma ka mākeke.
Ka manawa hoʻouna: Mei-27-2022