1. 0.5mm pitch QFP pad lōʻihi loa, kumu kaapuni pōkole.
2. He pōkole loa nā pā kumu PLCC, e hopena i ka hoʻoheheʻe ʻana.
3. He lōʻihi loa ka lōʻihi o ka pā o IC a ʻo ka nui o ka paʻi solder he nui ke kumu kaapuni pōkole i ka reflow.
4. He lōʻihi loa nā pā ʻēheu e pili ana i ka hoʻopiha ʻana i ka solder kuʻekuʻe a me ka pulu ʻana o ka kuʻekuʻe wāwae.
5. ʻO ka lōʻihi o ka pā o nā ʻāpana chip he pōkole loa, e hopena i nā pilikia kūʻai e like me ka neʻe ʻana, kaapuni hāmama, a me ka hiki ʻole ke kūʻai aku.
6. ʻO ka lōʻihi loa o nā ʻāpana ʻāpana chip e pilikia ai ke kūʻai ʻana e like me ke kia hoʻomanaʻo kū, ke kaapuni hāmama, a me ka liʻiliʻi o ka pī ma nā hui solder.
7. Akea loa ka laula o ka papa i ka hopena o na hemahema e like me ka hoonee ana o na mea, ka mea hao hao a me ka lawa ole o ka pahu ma ka pad.
8. He ākea ka laulā o ka pā a ʻaʻole i kūlike ka nui o ka pūʻolo me ka pad.
9. He haiki ka laula o ka mea i hooheheeia ma ka hope solder a me na pads PCB i ka hui pu ana o ka ili metala hiki ke hiki aku, e pili ana i ke ano o ka hui solder. .
10.Hoʻopili pololei ʻia nā pad solder i nā wahi nui o ke keleawe keleawe, ka hopena i nā hemahema e like me ke kū ʻana i nā monuments a me ka hoʻopunipuni hoʻopunipuni.
11. He nui a li'ili'i paha ka pahu solder pad pitch, 'a'ole hiki ke uhi 'ia ka hope solder component me ka overlap pad, kahi e ho'opuka ai i nā hemahema e like me ke kia ho'omana'o kū, ka ho'one'e, a me ka ho'opunipuni.
12. He nui loa ka mamao o ka pad solder ma muli o ka hiki ole ke hana i na hono solder.
Ka manawa hoʻouna: Jan-14-2022