1. 0.5mm pitch QFP pad lōʻihi loa, ka hopena i ka pōkole kaapuni.
2. He pōkole loa nā pā kumu PLCC, e hopena i ka hoʻoheheʻe ʻana.
3. He lōʻihi loa ka lōʻihi o ka pad o IC a he nui ka nui o ka solder paste i ka hopena pōkole i ka reflow.
4. He lōʻihi loa nā ʻāpana ʻēheu e pili ana i ka hoʻopiha ʻana o ka solder kuʻekuʻe wāwae a me ka pulu ʻana o ka kuʻekuʻe wāwae.
5. He pōkole loa ka lōʻihi o ka pā o nā ʻāpana chip, e hopena i ka hoʻololi ʻana, kaapuni hāmama, ʻaʻole hiki ke kūʻai ʻia a me nā pilikia kūʻai ʻē aʻe.
6. He lōʻihi loa ka lōʻihi o ka pā o nā ʻāpana ʻano chip, e hopena i ke kia hoʻomanaʻo kū, kaapuni hāmama, nā ʻāpana solder me ka liʻiliʻi o ka pī a me nā pilikia ʻē aʻe.
7. 'Akea loa ka laula o ka pa no ka ho'one'e 'ana o nā mea, ka mea kū'ai 'ole a me ka lawa 'ole o ka pī ma ka pad a me nā hemahema 'ē a'e.
8. 'Akea loa ka laula pa, ka nui o ka puolo a me ka like ole o ka papa.
9. He haiki ka laula pad, e pili ana i ka nui o ka solder hehee ma ka hope solder component a me ka pulupulu ili metala ma ka hui PCB pad, e pili ana i ke ano o ka solder joint, e hoemi ana i ka hilinai o ka solder joint.
10. Hoʻopili pololei ʻia ʻo Pad i kahi ʻāpana nui o ke keleawe keleawe, ka hopena i ke kia hoʻomanaʻo kū, ka mea kūʻai hoʻopunipuni a me nā hemahema ʻē aʻe.
11. ʻOi aku ka nui a i ʻole ka liʻiliʻi o ka pā pā, ʻaʻole hiki ke uhi ʻia ka hopena solder me ka uhi ʻana o ka pad, e hana i kahi kia hoʻomanaʻo, hoʻoneʻe ʻia, kūʻai hoʻopunipuni a me nā hemahema ʻē aʻe.
12. He nui loa ka pad pitch e hiki ai ke hana i kahi hui solder.
Ka manawa hoʻouna: Dec-16-2021