Ke Kaʻina Hana Packaging BGA

ʻO ka substrate a i ʻole ka papa waena he ʻāpana koʻikoʻi o ka pūʻulu BGA, hiki ke hoʻohana ʻia no ka mana impedance a no ka hoʻohui ʻana i ka inductor/resistor/capacitor me ka hoʻohui ʻana i nā uwila interconnect.No laila, pono ka mea substrate e loaʻa ke aniani hoʻololi kiʻekiʻe rS (ma kahi o 175 ~ 230 ℃), ke kūpaʻa kiʻekiʻe a me ka haʻahaʻa haʻahaʻa haʻahaʻa, ka hana uila maikaʻi a me ka hilinaʻi kiʻekiʻe.Pono ke kiʻi ʻoniʻoni metala, ka papa insulation a me ka media substrate e loaʻa i nā waiwai adhesion kiʻekiʻe ma waena o lākou.

1. ʻO ke kaʻina hana hoʻopili o ka PBGA i hoʻopaʻa ʻia

① Hoʻomākaukau ʻana i ka substrate PBGA

E hoʻopaʻa i ka pepa keleawe lahilahi (12~18μm mānoanoa) i nā ʻaoʻao ʻelua o ka BT resin/glass core board, a laila e wili i nā lua a me ka metallization ma loko o ka puka.Hoʻohana ʻia kahi kaʻina hana PCB me 3232 e hana i nā kiʻi ma nā ʻaoʻao ʻelua o ka substrate, e like me nā ʻāpana alakaʻi, nā electrodes, a me nā ʻāpana solder no ke kau ʻana i nā pōlele solder.Hoʻohui ʻia kahi mask solder a hana ʻia nā kiʻi e hōʻike i nā electrodes a me nā wahi solder.No ka hoʻomaikaʻi ʻana i ka hana ʻoi aku ka maikaʻi, loaʻa i kahi substrate he mau substrate PBG.

② Ke Kaʻina Hana Packaging

ʻOkiʻi wafer → hoʻopaʻa puʻupuʻu → hoʻomaʻemaʻe plasma → hoʻopaʻa alakaʻi → hoʻomaʻemaʻe plasma → pūʻolo i hoʻoheheʻe ʻia → hui ʻana o nā pōlele solder → hoʻoheheʻe ʻia i ka umu → hōʻailona ʻili → hoʻokaʻawale → ka nānā hope loa → hōʻike hopper packaging

Hoʻohana ka chip bonding i ka epoxy adhesive i hoʻopiha ʻia i ke kālā e hoʻopaʻa i ka chip IC i ka substrate, a laila hoʻohana ʻia ka hoʻopaʻa ʻana i ke kelepona gula e ʻike ai i ka pilina ma waena o ka chip a me ka substrate, a ukali ʻia e ka encapsulation plastik i hoʻoheheʻe ʻia a i ʻole nā ​​​​potting wai e pale ai i ka chip, nā laina solder. a me nā pads.Hoʻohana ʻia kahi mea hana koho kūikawā no ka hoʻokomo ʻana i nā pōpō solder 62/36/2Sn/Pb/Ag a i ʻole 63/37/Sn/Pb me kahi helu heheʻe o 183°C a me ke anawaena o 30 mil (0.75mm) ma ka nā pads, a me ka reflow soldering ua hana ʻia i loko o ka umu reflow maʻamau, me ka wela o ka hoʻoponopono kiʻekiʻe ʻaʻole i oi aku ma mua o 230°C.Hoʻomaʻemaʻe ʻia ka substrate me ka CFC mea hoʻomaʻemaʻe inorganic e wehe i nā ʻāpana solder a me nā fiber i waiho ʻia ma ka pūʻolo, a ukali ʻia e ka mākaʻikaʻi ʻana, ka hoʻokaʻawale ʻana, ka nānā hope ʻana, ka hoʻāʻo ʻana, a me ka ʻeke no ka mālama ʻana.ʻO ka mea i luna ke kaʻina hana hoʻopili o ke ʻano hoʻopaʻa alakaʻi PBGA.

2. Packaging kaʻina o FC-CBGA

① Pākuʻi seramika

ʻO ka substrate o FC-CBGA he multilayer ceramic substrate, he mea paʻakikī ke hana.No ka mea, he kiʻekiʻe ka uwila kiʻekiʻe o ka substrate, ka spacing haiki, a me ka nui o nā lua, a me ke koi o ka coplanarity o ka substrate he kiʻekiʻe.ʻO kāna kaʻina hana nui: ʻo ka mea mua, ua hoʻohui pū ʻia nā ʻāpana seramika multilayer i ka wela kiʻekiʻe e hana i kahi substrate seramika multilayer, a laila hana ʻia ka wili metala multilayer ma ka substrate, a laila hana ʻia ka plating, etc. , ʻO ka CTE mismatch ma waena o ka substrate a me ka chip a me ka papa PCB ke kumu nui e hoʻopau ai i nā huahana CBGA.No ka hoʻomaikaʻi ʻana i kēia kūlana, ma ka hoʻohui ʻana i ka hoʻolālā CCGA, hiki ke hoʻohana ʻia kahi pani seramika, ʻo ka HITCE ceramic substrate.

②Ke kahe kaʻina hana Packaging

Ka hoʻomākaukau ʻana i nā puʻupuʻu disc -> ʻoki disc -> chip flip-flop a reflow soldering -> hoʻopiha ʻia i lalo o ka ʻaila wela, hoʻohele ʻana i ka solder sealing -> ka hoʻopaʻa ʻana -> hui ʻana i nā pōpō solder -> hoʻihoʻi hou ʻana -> hōʻailona -> hoʻokaʻawale -> ka nānā hope loa -> hoʻāʻo -> hoʻopili

3. ʻO ke kaʻina hana hoʻopili o ke alakaʻi paʻa TBGA

① TBGA mea lawe lipine

Hana ʻia ka lipine lawe o TBGA me nā mea polyimide.

I ka hana ʻana, ua uhi mua ʻia nā ʻaoʻao ʻelua o ka lipine lawe keleawe, a laila uhi ʻia ka nickel a me ke gula, a ukali ʻia e ke kuʻi ʻana i loko o ka lua a me ka puka puka a me ka hana ʻana i nā kiʻi.No ka mea i loko o kēia TBGA i hoʻopaʻa ʻia ke alakaʻi, ua hoʻopili ʻia ka pā wela i hoʻopili ʻia me ka paʻa a me ka substrate cavity kumu o ka pūpū paipu, no laila ua hoʻopaʻa ʻia ka lipine lawe i ka paila wela me ka hoʻohana ʻana i ka paʻa paʻa ma mua o ka hoʻopili ʻana.

② Ke kahe kaʻina hana encapsulation

ʻOki ʻoki → ʻoki puʻupuʻu → hoʻopaʻa ʻoki → hoʻomaʻemaʻe → hoʻopaʻa alakaʻi → hoʻomaʻemaʻe plasma → potting sealant wai → hui pū ʻana o nā pōpō solder → hoʻoheheʻe hou → hōʻailona ʻili → hoʻokaʻawale → nānā hope → hoʻāʻo → hoʻopili

ʻO Zhejiang NeoDen Technology Co., LTD., i hoʻokumu ʻia i ka makahiki 2010, he mea hana loea i ka mīkini koho SMT a me kahi mīkini, reflow umu, mīkini paʻi stencil, laina hana SMT a me nā huahana SMT ʻē aʻe.

Ke manaʻoʻiʻo nei mākou he poʻe maikaʻi a me nā hoa hana ʻo NeoDen i ʻoihana maikaʻi a ʻo kā mākou kūpaʻa i ka Innovation, Diversity and Sustainability e hōʻoia i ka loaʻa ʻana o ka automation SMT i kēlā me kēia mea hobbyist ma nā wahi āpau.

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