4 Nā ʻano o nā lako hana hou SMT

Hiki ke hoʻokaʻawale ʻia nā kikowaena SMT rework i 4 mau ʻano e like me kā lākou hana ʻana, noi a me ka paʻakikī: ʻano maʻalahi, ʻano paʻakikī, ʻano infrared a me nā ʻano ea wela infrared.

1. ʻAno maʻalahi: ʻoi aku ka maʻamau o kēia ʻano mea hana hou ma mua o ke kūʻokoʻa kūʻokoʻa i ka mea hana hao, hiki ke koho i ka hoʻohana ʻana i nā kikoʻī like ʻole o ke poʻo hao e like me nā kikoʻī ʻāpana, ʻāpana o ka ʻōnaehana a me ka PCB paʻa paʻa hana, ʻoi loa no ka puka puka. ka hoʻoheheʻe ʻana i nā mea, ka hoʻoheheʻe chip a me ka wehe ʻana i ka chip, etc.

2. ʻAno paʻakikī: paʻakikī ʻano hana hana hou a me nā ʻano hana hana maʻalahi, ke hoʻohālikelike ʻia me nā mea ʻelua hiki ke hoʻokaʻawale i nā ʻāpana, ka uhi ʻana i ka solder paste, ke kau ʻana i nā ʻāpana a me nā ʻāpana wili, ʻo ka mea koʻikoʻi ʻoi aku ka ʻōnaehana hoʻonohonoho kiʻi, ʻōnaehana hoʻomalu wela, hoʻopaʻa ʻia ʻana o ka vacuum suction a ʻōnaehana hoʻokuʻu, a me nā mea ʻē aʻe. ʻO kēia ʻano mea hana he mea hana hou GOOT,BGA hale hana hou, etc.

3. 'Ano Infrared: Infrared type rework mea nui ka hoʻohana 'ana i ka infrared radiation wela hopena e hoʻopau i ka rework o nā mea, infrared radiation hoʻomehana hopena i uniformity, 'aʻohe kūloko hoʻoluʻu hanana i ka wā e wela ea reflow wela, ka hoʻomaka wela lohi, ka ʻO ka wikiwiki o ka hoʻomehana ʻana, komo ikaika, akā ʻo ka hana hou ʻana i nā manawa he maʻalahi ka papa PCB e hana i ka delamination ma ka lua.

4. ʻAno ea wela infrared: ʻano hana hou ʻana o ka ea wela infrared ma o ka hui pū ʻana o ka infrared a me ka wela sub heating no ka hana hou ʻana, me ka hoʻopaʻa ʻana i nā pono o ka infrared a me ka ea hana hou.Inā hoʻohana ʻoe i ka hoʻomehana hoʻomau infrared piha, maʻalahi ke alakaʻi i ka instability o ka wela, ʻoi aku ka nui o ka ʻili hoʻomehana infrared, a laila ʻo kekahi o ka potting board inā ʻaʻole i pale ʻia, e alakaʻi ʻo BGA i ka puʻupuʻu puʻupuʻu a puni, e like me ka hoʻoponopono kamepiula maʻamau. ʻaʻole ka hoʻomehana infrared piha, akā ʻo ka hoʻohana ʻana i ka infrared hot air combined heat.

Nā hiʻohiʻona oNeoDenBGA hana hou

Mana Mana: AC220V±10%, 50/60HZ

Mana: 5.65KW(Max), ʻO ka wela wela (1.45KW)

ʻO ka mea wela lalo (1.2KW), IR Preheater (2.7KW), ʻē aʻe (0.3KW)

Nui PCB: 412*370mm(Max);6*6mm(Min)

BGA Chip Nui: 60*60mm(Max);2*2mm(Min)

IR Heater Nui: 285*375mm

ʻIke wela: 1 pcs

Ka Hana Hana: 7″ HD paʻi pā

Pūnaehana hoʻomalu: Pūnaehana hoʻomalu wela kūʻokoʻa V2

Pūnaehana Hōʻike: 15 ″ hōʻike ʻenehana SD (720P pale mua)

Nā Kūlana Kūlana: 2 miliona pixel SD Digital System System e noʻonoʻo nei i ka'ōnaehana o ka'ōnaehana

Hoʻomoʻa ʻana i ka ʻūhā: ʻakomi

Ka pololei o ka Alignment: ± 0.02mm

Mana Manawa: K-type thermocouple paʻa-loop mana me ka pololei a hiki i ±3 ℃

Mea Hanai: ʻAʻole

Hoʻonohonoho: V-groove me ka mea hoʻopili honua