110 mau ʻike ʻike o ka hoʻoili ʻana i ka chip SMT - Māhele 1
1. ʻO ka mea maʻamau, ʻo 25 ± 3 ℃ ka mahana o ka SMT chip processor;
2. ʻO nā mea a me nā mea e pono ai no ka paʻi paʻi solder, e like me ka solder paste, ka pā kila, ka ʻōpala, ka pepa holoi, ka pepa lepo ʻole, ka mea holoi a me ka pahi hui;
3. ʻO ka hui maʻamau o ka pāpaʻi solder alloy ʻo Sn / Pb alloy, a ʻo ka mahele o ka alloy he 63 / 37;
4. ʻElua mau mea nui i loko o ka solder paste, ʻo ia ka pauka tin a me ka flux.
5. ʻO ka hana nui o ka flux i ka hoʻoheheʻe ʻana, ʻo ia ka wehe ʻana i ka oxide, e hōʻino i ka haʻalulu o waho o ka tin hehee a pale i ka reoxidation.
6. ʻO ka lākiō leo o nā ʻāpana pauda tin i ka flux ma kahi o 1:1 a ʻo ka lākiō ʻāpana ma kahi o 9:1;
7. ʻO ke kumu o ka solder paste ka mea mua i waho;
8. Ke hoʻohana ʻia ka paʻi solder ma Kaifeng, pono e hoʻomaʻamaʻa hou ʻia a hui pū ʻia ma o nā hana koʻikoʻi ʻelua;
9. ʻO nāʻano hana maʻamau o ka pā kila: etching, laser and electroforming;
10. ʻO ka inoa piha o ka ʻenehana SMT chip ka ʻenehana mauna (a i ʻole ke kau ʻana), ʻo ia hoʻi ka ʻenehana adhesion (a i ʻole ke kau ʻana) ma ka ʻōlelo Kina;
11. ʻO ka inoa piha o ESD he electro static discharge, ʻo ia hoʻi ka hoʻokuʻu electrostatic ma ka ʻōlelo Kina;
12. I ka wā e hana ai i ka polokalamu lako SMT, aia ka papahana i ʻelima mau ʻāpana: ʻikepili PCB;hōʻailona ʻikepili;ʻikepili hānai;ʻikepili puzzle;ʻikepili hapa;
13. O ka helu hehee o Sn / Ag / Cu 96.5 / 3.0 / 0.5 he 217c;
14. ʻO ka mahana pili a me ka haʻahaʻa o nā ʻāpana hoʻomaloʻo i ka umu he <10%;
15. ʻO nā mea hana paʻa i hoʻohana mau ʻia e pili ana i ke kū'ē, capacitance, point inductance (a i ʻole diode), etc.;ʻO nā mea hana e pili ana i nā transistors, IC, a pēlā aku;
16. ʻO ka mea maka o ka pā kila SMT i hoʻohana mau ʻia he kila kila;
17. ʻO 0.15mm (a i ʻole 0.12mm ka mānoanoa o ka pā kila SMT maʻamau);
18. ʻO nāʻano likeʻole o ka hoʻoili electrostatic e pili ana i ka hakakā, ka hoʻokaʻawaleʻana, ka hoʻokomoʻana, ka hoʻokele electrostatic, a me nā mea'ē aʻe;ʻO ka hopena o ka uku electrostatic ma luna o ka ʻoihana uila ʻo ia ka hemahema ESD a me ka pollu electrostatic;ʻO nā kumumanaʻo ʻekolu o ka hoʻopau electrostatic ʻo ka electrostatic neutralization, grounding a me ka pale.
19. ʻO ka lōʻihi x laula o ka ʻōnaehana Pelekane ʻo 0603 = 0.06 iniha * 0.03 ʻīniha, a ʻo ka ʻōnaehana metric he 3216 = 3.2mm * 1.6mm;
20. Hōʻike ka helu 8 “4″ o erb-05604-j81 he 4 kaapuni, a ʻo ka waiwai kūʻē he 56 ohm.ʻO ka mana o eca-0105y-m31 he C = 106pf = 1NF = 1×10-6f;
21. ʻO ka inoa Kina piha o ECN he leka hoʻololi ʻenehana;ʻO ka inoa Kina piha o SWRʻo ia: kauoha hana me nā pono kūikawā, pono e hoʻopaʻa inoaʻia e nā keʻena kūpono a māheleʻia i waena, he mea pono;
22. ʻO nā mea kiko'ī o 5S ka hoʻomaʻemaʻe, hoʻokaʻawale, hoʻomaʻemaʻe, hoʻomaʻemaʻe a me ka maikaʻi;
23. ʻO ke kumu o ka PCB vacuum packaging ka pale ʻana i ka lepo a me ka wai;
24. ʻO ke kulekele maikaʻi: nā mana maikaʻi a pau, e hahai i nā pae hoʻohālike, e hoʻolako i ka maikaʻi i makemakeʻia e nā mea kūʻai;ke kulekele o ke komo piha, ka lawelawe ʻana i ka manawa, e hoʻokō ai i kahi kīnā ʻole;
25. ʻO nā kulekele ʻekolu no ka maikaʻi ʻole: ʻaʻole ʻae ʻia nā huahana kīnā ʻole, ʻaʻole hana i nā huahana kīnā ʻole a ʻaʻole puka i waho o nā huahana kīnā ʻole;
26. Ma waena o nā ʻano QC ʻehiku, ʻo 4m1h e pili ana i (Pake): kanaka, mīkini, mea, ʻano hana a me ke kaiapuni;
27. ʻO ka hui ʻana o ka solder paste e komo pū ana: ka pauka metala, Rongji, flux, anti vertical flow agent and active agent;e like me ka ʻāpana, ʻo ka pauka metala he 85-92%, a ʻo ka nui o ka pauka metala he 50%;i waena o lākou, ʻo nā mea nui o ka pauka metala he tin a me ke alakaʻi, ʻo ka mahele he 63 / 37, a ʻo ka helu heheʻe he 183 ℃;
28. I ka hoʻohana ʻana i ka solder paste, pono ia e lawe i waho o ka friji no ka hoʻihoʻi ʻana i ka mahana.ʻO ka manaʻo e hoʻihoʻi ka mahana o ka solder paste i ka mahana maʻamau no ka paʻi ʻana.Inā ʻaʻole i hoʻihoʻi ʻia ka mahana, maʻalahi ke hana ʻana o ka solder bead ma hope o ke komo ʻana o PCBA i ka reflow;
29. Aia nā palapala ho'olako o ka mīkini: palapala ho'omākaukau, palapala kama'ilio mua, palapala kama'ilio a me ka palapala pili wikiwiki;
30. ʻO nā ʻano hoʻonohonoho PCB o SMT e like me: Ka hoʻonohonoho ʻana i ka ʻūhā, ka hoʻonohonoho ʻana i ka puka mechanical, ka hoʻonohonoho ʻana i ka lua a me ka hoʻonohonoho ʻana o ka papa;
31. He 2700 Ω ke kū'ē me ka pale siliki 272 (hōʻailona), a ʻo ka hōʻailona (silk screen) o ke kūʻē me ka waiwai kūʻē o 4.8m Ω he 485;
32. ʻO ka paʻi kilika ma ke kino BGA e pili ana i ka mea hana, ka helu hapa o ka mea hana, maʻamau a me Datecode / (lot no);
33. He 0.5mm ka pahu o 208pinqfp;
34. Ma waena o nā ʻano QC ʻehiku, ʻo ke kiʻikuhi iwi iʻa ka nānā ʻana i ka pilina kumu;
37. E pili ana ka CPK i ke ka'ina hana ma lalo o ka hana o kēia manawa;
38. Hoʻomaka ka Flux e transpiration i loko o ka ʻāpana wela mau no ka hoʻomaʻemaʻe kemika;
39. He mau kiʻi aniani ka ʻāpana hoʻoluʻu kūpono a me ka ʻāpana reflux;
40. Ke hoʻomehana ʻia nei ka pihi RSS → ka wela mau → reflux → ka hoʻoluʻu;
41. ʻO ka mea PCB a mākou e hoʻohana nei ʻo FR-4;
42. ʻAʻole ʻoi aku ka maʻamau PCB warpage ma mua o 0.7% o kona diagonal;
43. ʻO ka ʻokiʻoki laser i hana ʻia e ka stencil he ala e hiki ke hana hou ʻia;
44. ʻO ke anawaena o ka pōpō BGA i hoʻohana pinepine ʻia ma ka papa nui o ka lolouila he 0.76mm;
45. ʻO ka ʻōnaehana ABS ka hoʻonohonoho maikaʻi;
46. ʻO ka hewa o ka capacitor chip seramika eca-0105y-k31 he ± 10%;
47. Panasert Matsushita piha hana Mounter me ka volta o 3?200 ± 10vac;
48. No nā ʻāpana ʻāpana SMT, ʻo ke anawaena o ka pahu lipine he 13 iniha a me 7 ʻīniha;
49. ʻO ka weheʻana o SMT he 4um ka liʻiliʻi ma mua o ka PCB pad, hiki ke pale i keʻano o ka pōlele solder maikaʻiʻole;
50. E like me ka PCBA inspection rules, ke oi aku ka huina dihedral ma mua o 90 degere, e hoike mai ana aole pili ka solder paste i ke kino solder hawewe;
51. Ma hope o ka wehe ʻana o ka IC, inā ʻoi aku ka nui o ka haʻahaʻa ma ke kāleka ma mua o 30%, e hōʻike ana i ka IC he pulu a hygroscopic;
52. ʻO ka lakio mea pono a me ka ratio leo o ka pauda tin i ka hoʻololi ʻana i loko o ka paʻi solder he 90%: 10%, 50%: 50%;
53. ʻO nā mākau hoʻopaʻa ʻike mua i loaʻa mai ka pūʻali koa a me nā kahua Avionics i ka waena waena o 1960s;
54. ʻOkoʻa nā mea i loko o Sn a me Pb i loko o ka solder paste i hoʻohana mau ʻia ma SMT.
Ka manawa hoʻouna: Sep-29-2020